Anisotropic conductive film flip chip joining using thin chips

Microelectronics Reliability

Volumn 42, Issue 12, 2002, Pages 1913-1920

  Jokinen, Erja ^a   Ristolainen, Eero ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; BENDING (DEFORMATION); BONDING; CONDUCTIVE FILMS; FLIP CHIP DEVICES; GOLD; POLYETHYLENES; SCANNING ELECTRON MICROSCOPY; THERMAL CYCLING;

THIN CHIPS;

MICROELECTRONICS;

EID: 0036890948     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00100-2     Document Type: Article

References (14)

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