A study of process-induced deformations of anisotropic conductive film (ACF) assembly

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 3, 2006, Pages 577-588

  Cheng, Hsien Chie ^a   Ho, Cheng Lin ^b   Chen, Wen Chih ^c   Yang, Sheng Shu ^d  

^a FENG CHIA UNIVERSITY   (Taiwan)

^b CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

^c INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^d Taiwan TFT LCD Association   (Taiwan)

Author keywords

Anisotropic conductive film (ACF) bonding technology; Death birth meshing scheme; Finite element (FE) modeling; Parametric study; Process induced warpage; Response surface methods (RSMs)

Indexed keywords

ANISOTROPY; BONDING; CONDUCTIVE FILMS; DEFORMATION; FINITE ELEMENT METHOD; LIQUID CRYSTAL DISPLAYS; THERMAL EXPANSION; THERMAL GRADIENTS; THERMOANALYSIS; THIN FILM TRANSISTORS;

ANISOTROPIC CONDUCTIVE FILM (ACF); BONDING PROCESS; CHIP-ON-GLASS (COG); THIN-FILM TRANSISTOR LIQUID CRYSTAL DISPLAY (TFT-LCD);

CHIP SCALE PACKAGES;

EID: 33748540423     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.880507     Document Type: Article

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