Experimental wetting dynamics study of eutectic and lead-free solders varying flux, temperature and surface finish metallization

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 56-63

  Kang, Suk Chae ^a,b   Kim, Chunho ^a,c   Muncy, Jennifer ^a,d   Schmidt, Michael ^a   Baldwin, Daniel ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

^c INTEL CORPORATION   (United States)

^d IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAY (BGA); ISOTHERMAL SPREADING; MARANGONI EFFECTS; WETTING DYNAMICS;

CHIP SCALE PACKAGES; CONTACT ANGLE; EUTECTICS; FLIP CHIP DEVICES; ISOTHERMS; METALLIZING; OPTICAL INTERCONNECTS; SOLDERED JOINTS; SURFACE TENSION; VISCOSITY; WETTING;

SOLDERING ALLOYS;

EID: 4644313572     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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