Role of surface properties on the wettability of Sn-Pb-Bi solder alloys

Journal of Alloys and Compounds

Volumn 282, Issue 1-2, 1999, Pages 279-285

  Prasad, L C ^b   Mikula, A ^a  

^a UNIVERSITY OF VIENNA   (Austria)

^b T M BHAGALPUR UNIVERSITY   (India)

Author keywords

De wetting; Sn based solder alloys; Sn Pb Bi; Surface segregation; Surface tension

Indexed keywords

COMPOSITION EFFECTS; INTERMETALLICS; LIQUID METALS; MATHEMATICAL MODELS; SEGREGATION (METALLOGRAPHY); SOLDERED JOINTS; SOLDERING ALLOYS; STATISTICAL MECHANICS; SURFACE PROPERTIES; SURFACE TENSION; THERMAL EFFECTS; WETTING;

DEWETTING;

TIN ALLOYS;

EID: 0032761828     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0925-8388(98)00831-7     Document Type: Article

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