Kinetics of the isothermal spreading of tin on the air-passivated copper surface in the absence of a fluxing agent

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Volumn 144, Issue 1-3, 1998, Pages 89-114

  Peebles, D E ^a   Peebles, H C ^a   Ohlhausen, J A ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Copper; Kinetics; Solder; Spreading; Tin

Indexed keywords

COPPER; TIN;

ARTICLE; CONTROLLED STUDY; ENERGY; KINETICS; NONHUMAN; PRIORITY JOURNAL; SAMPLE; SURFACE PROPERTY; TEMPERATURE;

EID: 0032553841     PISSN: 09277757     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0927-7757(98)00644-X     Document Type: Article

References (44)

1. de Gennes P.G. Wetting: statics and dynamics. Rev. Mod. Phys. 57:1985;827-863.
2. R.T. Beyer, E.M. Ring, The viscosity of liquid metals, in: S.Z. Beer (Ed.), Liquid Metals: Chemistry and Physics, Marcel Dekker, New York, 1972.
3. L.E. Murr, Interfacial Phenomena in Metals and Alloys, Addison-Wesley, New York, 1975.
4. A.D. Romig et al., Physical metallurgy of solder-substrate reactions, in: D.R. Frear, W.B. Jones, K.R. Kinsman (Eds.), Solder Mechanics: A State of the Art Assessment, The Minerals, Metals, and Materials Society, Warrendale, PA, 1991.
5. Smith G.C., Lea C. Wetting and spreading of liquid metals: the role of surface composition. Surf. Interface Anal. 9:1986;145-150.
6. Peebles D.E.et al. Dynamic measurements of the spreading of liquid metals in controlled atmospheres with in situ surface preparation and analysis. Rev. Sci. Instrum. 67(2):1996;512-521.
7. Savitzky A., Golay M.J.E. Smoothing and differentiation of data by simplified least squares procedures. Anal. Chem. 36:1964;1627-1639.
8. Steinier J., Termonia Y., Deltour J. Comments on smoothing and differentiation of data by simplified least square procedure. Anal. Chem. 44:1972;1906-1909.
9. Madden H.H. Comments on the Savitzky-Golay convolution method for least-squares fit smoothing and differentiation of digital data. Anal. Chem. 50:1978;1383-1386.
10. C.D. Wagner et al., Handbook of X-Ray Photoelectron Spectroscopy, Perkin-Elmer Corporation, Eden Prairie, MN, 1979.
11. F.C. Tompkins, Chemisorption of Gases on Metals, Academic Press, New York, 1978.
12. Y. Koga, L.G. Harrison, Reactions of solids with gases other than oxygen, in: C.H. Bamford, C.F.H. Tipper, R.G. Compton (EDs.), Comprehensive Chemical Kinetics, vol. 21, Reactions of Solids with Gases, Elsevier, New York, 1984.
13. O surfaces during vacuum outgassing. Appl. Surf. Sci. 16:1983;441-452.
14. Klein J.C.et al. Decomposition of copper compounds in X-ray photoelectron spectrometers. Appl. Spectrosc. 38:1984;729-734.
15. McIntyre N.S.et al. Chemical Information from XPS - applications to the analysis of electrode surfaces. J. Vac. Sci. Technol. 18:1981;714-721.
16. Pedocchi L.et al. ESCA study of the oxidation of DHP copper. Surf. Interface Anal. 19:1992;414-418.
17. Speckmann H.D., Haupt S., Strehblow H.H. A quantitative surface analytical study of electrochemically-formed copper oxides by XPS and X-ray induced Auger spectroscopy. Surf. Interface Anal. 11:1988;148-155.
18. Miller A.C., Simmons G.W. Copper by XPS. Surf. Sci. Spectra. 2:1993;55-60.
19. Klein J.C.et al. X-ray excited Auger intensity ratios for differentiating copper compounds. Anal. Chem. 55:1983;2055-2059.
20. 2S thin films. J. Electron Spectrosc. Relat. Phenom. 4:1974;213-218.
21. Li J. et al., Oxidation and Reduction of Copper Oxide Thin Films. J. Appl. Phys. 69:1991;1020-1029.
22. Zhao L.Z.et al. XPS studies of oxide films on transition metals. J. Electron Spectrosc. Relat. Phenom. 52:1990;571-580.
23. Seah M.P., Dench W.A. Quantitative electron spectroscopy of surfaces: a standard data base for electron inelastic mean free paths in solids. Surf. Interface Anal. 1:1979;2-11.
24. Stefanov P., Marinova T. Adsorption of oxygen and formation of an oxide phase on a Cu(100) Surface. Appl. Surf. Sci. 31:1988;445-450.
25. H.W. Pickering, Initial stages of oxidation of Cu, Ni and Cu-1% Fe by atom-probe field ion microscopy, in: Symposium on Applications of Surface Analytical Methods to Environmental/Materials Interactions, Electrochemical Society, Seattle, WA, 1990.
26. Barr T.L. Studies of metals and alloys: oxidation, migration and dealloying of Cu-based systems. Surf. Interface Anal. 4:1982;185-193.
27. Taylor T.N., Martin J.A. Reaction of vapor-deposited aluminum with copper oxides. J. Vac. Sci. Technol. A: 9(3):1991;1840-1846.
28. Sieffering K.L., Griffin G.L. Surf. Sci. 207:1989;525.
29. Hegde M.S., Kumar T.S.S., Mallya R.M. Appl. Surf. Sci. 17:1983;97.
30. Yoon C., Cocke D.L. Oxidation studies of copper-manganese alloys - a basis for model catalyst preparation. Appl. Surf. Sci. 31:1988;118-150.
31. Castle J.E., Nasserian-Riabi M. Corrosion Sci. 15:1975;537.
32. Yurek G.J., Rapp R.A., Hirth J.P. Metall. Trans. 4:1973;1293.
33. Rapp R.A., Ezis A., Yurek G.J. Metall. Trans. 4:1973;1283.
34. Kumar T.S.S., Hegde M.S. Surface segregation and oxidation studies of Cu-Sn and Cu-Pd alloys by X-ray photoelectron and Auger spectroscopy. Appl. Surf. Sci. 20:1985;290-306.
35. Outokumpu HSC Chemistry for Windows, Outokumpu Research Oy, Finland, 1993.
36. Kawakatsu I., Osawa T. Wettability of liquid tin on solid copper. Trans. Jpn. Inst. Met. 14:1973;114.
37. Benndorf C.et al. Oxygen interaction with Cu(100) studied by AES, ELS, LEED and work function changes. J. Phys. Chem. Solids. 140:1979;877-886.
38. Yoon C., Cocke D.L. Evidence for electron transfer control of oxygen incorporation into bulk copper. J. Electrochem. Soc. 134:1987;643-644.
39. 2. Surf. Sci. 179:1987;377-386.
40. Hupkens T.M., Fluit J.M., Niehaus A. LEIS study of the adsorption of oxygen on a Cu(110) surface. Stage II: coverage above half a monolayer. Surf. Sci. 165:1986;327-336.
41. Bloch J.et al. Kinetics of oxygen adsorption, absorption, and desorption on the Cu(111) surface. J. Chem. Phys. 98:1993;9167-9176.
42. Bloch J.et al. Detection of subsurface oxygen on Cu(111): correlation of second-harmonic generation and Auger electron spectroscopy observations. Surf. Sci. 257:1991;328-334.
43. Benndorf C.et al. Oxygen adsorption on polycrystalline Cu films studied by means of gravimetric uptake and work function change. J. Vac. Sci. Technol. 15:1978;1806-1808.
44. 2O with a Cu(111) surface and of the reaction of CO with adsorbed oxygen using AES, LEES and ellipsometry. Surf. Sci. 83:1979;45-59.