The thermal property of lead-free Sn-8.55Zn-1Ag-XAl solder alloys and their wetting interaction with Cu

Journal of Electronic Materials

Volumn 31, Issue 9, 2002, Pages 940-945

  Cheng, Shou Chang ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Intermetallics; Lead free solder; Liquidus temperature; Sn Zn; Solidus temperature; Wettability; Wetting force; Wetting time

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; HEAT RESISTANCE; INTERMETALLICS; TIN ALLOYS; WETTING;

WETTING FORCE;

SOLDERING ALLOYS;

EID: 0036738902     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0187-3     Document Type: Article

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