Spreading kinetics of liquid solders over an intermetallic solid surface. Part 1: Eutectic lead solder

Journal of Electronic Materials

Volumn 38, Issue 9, 2009, Pages 1838-1845

  Zhao, H ^a   Wang, H Q ^b   Sekulic, D P ^a,c   Qian, Y Y ^d  

^a Center for Manufacturing   (United States)

^b SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^c UNIVERSITY OF KENTUCKY   (United States)

^d HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Intermetallics; Solders; Spreading

Indexed keywords

CONTROLLED ATMOSPHERE; CU SUBSTRATE; DATA GATHERING; EXPERIMENTAL STUDIES; HEAT TREATMENT CONDITIONS; HOT-STAGE MICROSCOPY; IN-SITU MONITORING; INITIAL STAGES; LEAD SOLDERS; LIQUID SOLDERS; POWER LAW EXPONENT; POWER-LAW; QUANTITATIVE INVESTIGATION; SOLDERS; SOLID SURFACE; SPREADING; SPREADING KINETICS; SUBSTRATE TOPOGRAPHY;

BRAZING; EUTECTICS; LAWS AND LEGISLATION; LEAD; LEAD ALLOYS; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; SUBSTRATES; WELDING;

TIN;

EID: 68949097514     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0869-1     Document Type: Article

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