Reflow atmospheres in the lead-free era

Circuits Assembly

Volumn 14, Issue 3, 2003, Pages 26-35

  Mackie, Anay C ^a  

^a PRAXAIR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GLASS TRANSITION; INTERFACES (MATERIALS); MELTING; PRINTED CIRCUIT BOARDS; SURFACE TENSION; THERMOCOUPLES; WETTING;

SOLDER PASTES;

SOLDERING ALLOYS;

EID: 0037349575     PISSN: 10540407     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (16)

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2. Lee. 1998. A thorough look at lead-free solder alternatives. Circuits Assembly, April, pp. 64-71.
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4. IPC. 1996. ANSI/IPC Standard J-STD-006A, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders. IPC-Association Connecting Electronics Industries.
5. Mackie. 2001. Solder paste drying in printing and placement. Circuits Assembly Online. November.
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7. Boettinger, et al. 1993. Reactive wetting and intermetallic formation. The Mechanics of Solder Alloy Wetting and Spreading. Van Nostrand Reinhold, pp. 103-140.
8. th European Microelectronics & Packaging Conference. June, pp. 98-106.
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12. nd ed. Electrochemical Publications, p. 40.
13. Grusd. 1999. Personal communication with author. July.
14. Verbockhaven, et al. 1997. Using nitrogen on OSP-coated printed circuit boards. Electronics Packaging & Production. April.
15. Lea. 1997. Influence of component solderability on reliability of solder joints. Design and Reliability of Solders and Solder Connections, TMS. pp. 273-278.
16. Baggio and Suetsugu. 1999. Guidelines for lead-free processing. SMT. September, pp. 60-66.