Thermal characterization of interlayer microfluidic cooling of three-dimensional IC with non-uniform heat flux

Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009

Volumn , Issue PART B, 2009, Pages 1249-1258

  Kim, Yoon Jo ^a   Joshi, Yogendra K ^a   Fedorov, Andrei G ^a   Lee, Young Joon ^b   Lim, Sung Kyu ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SCHEME; ELECTRICAL INTERCONNECTS; ENABLING TECHNOLOGIES; FLUID TEMPERATURES; GEOMETRY VARIATIONS; HOT SPOT; HYDRAULIC PERFORMANCE; INTERNAL PRESSURE; LIMITING FACTORS; MASS FLOW RATE; NONUNIFORM; PROCESSING SPEED; SYSTEM INTEGRATION; THERMAL CHARACTERIZATION; THERMAL MANAGEMENT; THREE-DIMENSIONAL (3D);

COOLING; MICROFLUIDICS; MULTIPHASE FLOW; REFRIGERANTS; TEMPERATURE CONTROL; THREE DIMENSIONAL;

MICROCHANNELS;

EID: 77952818765     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ICNMM2009-82133     Document Type: Conference Paper

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