-
1
-
-
0003352129
-
Thermal performance challenges from silicon to systems
-
Viswanath, et al., "Thermal performance challenges from silicon to systems," Intel Technology Journal, vol. 3, pp. 1-16, 2000.
-
(2000)
Intel Technology Journal
, vol.3
, pp. 1-16
-
-
Viswanath1
-
2
-
-
33845580323
-
Embedded thermoelectric coolers for semiconductor hot spot cooling
-
Koester, et al., "Embedded thermoelectric coolers for semiconductor hot spot cooling," ITHERM '06. 2006, pp. 491-496.
-
(2006)
ITHERM '06
, pp. 491-496
-
-
Koester1
-
3
-
-
34548025127
-
On-chip hot spot cooling using silicon thermoelectric microcoolers
-
W. Peng and B.-C. Avram, "On-chip hot spot cooling using silicon thermoelectric microcoolers," Journal of Applied Physics, vol. 102, p. 034503, 2007.
-
(2007)
Journal of Applied Physics
, vol.102
, pp. 034503
-
-
Peng, W.1
Avram, B.-C.2
-
4
-
-
50949093590
-
Thin film thermoelectric cooler thermal validation and product thermal performance estimation
-
p. 6 pp
-
Sridhar, et al., "Thin film thermoelectric cooler thermal validation and product thermal performance estimation," ITHERM '06. 2006, p. 6 pp.
-
ITHERM '06
, pp. 2006
-
-
Sridhar1
-
5
-
-
33947242257
-
Direct liquid cooling of high flux micro and nano electronic components
-
Bar-Cohen, et al., "Direct liquid cooling of high flux micro and nano electronic components," Proceedings of the IEEE, vol. 94, pp. 1549-1570, 2006.
-
(2006)
Proceedings of the IEEE
, vol.94
, pp. 1549-1570
-
-
Bar-Cohen1
-
6
-
-
0019563707
-
High-performance heat sinking for VLSI
-
D. B. Tuckerman and R. F. W. Pease, "High-performance heat sinking for VLSI," Electron Device Letters, IEEE, vol. 2, pp. 126-129, 1981.
-
(1981)
Electron Device Letters, IEEE
, vol.2
, pp. 126-129
-
-
Tuckerman, D.B.1
Pease, R.F.W.2
-
7
-
-
50949124534
-
Fluid-to-Fluid Spot-to-Spreader Heat Management Devices and Systems and Methods of Managing Heat
-
US Patent App. 60/954,360, 2007
-
A. G. Fedorov,"Fluid-to-Fluid Spot-to-Spreader Heat Management Devices and Systems and Methods of Managing Heat", US Patent App. 60/954,360, 2007.
-
-
-
Fedorov, A.G.1
-
10
-
-
0004245602
-
International Technology Roadmap for Semiconductors 2006 Update
-
"International Technology Roadmap for Semiconductors 2006 Update," 2006.
-
(2006)
-
-
-
14
-
-
0033743156
-
Optimization of Parallel Plate Heatsinks for Forced Convection
-
D. Copeland, "Optimization of Parallel Plate Heatsinks for Forced Convection," in Sixteenth IEEE SEMI-THERM Symposium, 2000.
-
(2000)
Sixteenth IEEE SEMI-THERM Symposium
-
-
Copeland, D.1
-
15
-
-
0000351691
-
New Correlations for Heat and Mass Transfer in Turbu-lent Pipe and Channel Flow
-
V. Gnielinski, "New Correlations for Heat and Mass Transfer in Turbu-lent Pipe and Channel Flow," Int. Chem. Eng, vol. 16, pp. 359-368, 1976.
-
(1976)
Int. Chem. Eng
, vol.16
, pp. 359-368
-
-
Gnielinski, V.1
-
16
-
-
29544435519
-
A Systematic Methodology for Optimal Design of Two-Phase Micro-Channel Heat Sinks
-
W. Qu and I. Mudawar, "A Systematic Methodology for Optimal Design of Two-Phase Micro-Channel Heat Sinks," Journal of Electronic Packaging, vol. 127, p. 381, 2005.
-
(2005)
Journal of Electronic Packaging
, vol.127
, pp. 381
-
-
Qu, W.1
Mudawar, I.2
-
19
-
-
0032076884
-
Prandtl number dependence of impingement heat transfer with circular free-surface liquid jets
-
Sun, et al., "Prandtl number dependence of impingement heat transfer with circular free-surface liquid jets," International Journal of Heat and Mass Transfer, vol. 41, pp. 1360-1363, 1998.
-
(1998)
International Journal of Heat and Mass Transfer
, vol.41
, pp. 1360-1363
-
-
Sun1
-
20
-
-
0037126920
-
A numerical study of the unsteady flow and heat transfer in a transitional confined slot jet impinging on an isothermal surface
-
V. A. Chiriac and A. Ortega, "A numerical study of the unsteady flow and heat transfer in a transitional confined slot jet impinging on an isothermal surface," International Journal of Heat and Mass Transfer, vol. 45, pp. 1237-1248, 2002.
-
(2002)
International Journal of Heat and Mass Transfer
, vol.45
, pp. 1237-1248
-
-
Chiriac, V.A.1
Ortega, A.2
-
21
-
-
23644434113
-
Optimized Heat Transfer for High Power Electronic Cooling Using Arrays of Microjets
-
M. Fabbri and V. K. Dhir, "Optimized Heat Transfer for High Power Electronic Cooling Using Arrays of Microjets," Journal of heat transfer, vol. 127, p. 760, 2005.
-
(2005)
Journal of heat transfer
, vol.127
, pp. 760
-
-
Fabbri, M.1
Dhir, V.K.2
-
22
-
-
31744436708
-
Effect of nozzle geometry on pressure drop and heat transfer in submerged jet arrays
-
A. Royne and C. J. Dey, "Effect of nozzle geometry on pressure drop and heat transfer in submerged jet arrays," International Journal of Heat and Mass Transfer, vol. 49, pp. 800-804, 2006.
-
(2006)
International Journal of Heat and Mass Transfer
, vol.49
, pp. 800-804
-
-
Royne, A.1
Dey, C.J.2
-
23
-
-
32144453365
-
Single-phase and two-phase cooling with an array of rectangular jets
-
Meyer, et al., "Single-phase and two-phase cooling with an array of rectangular jets," International Journal of Heat and Mass Transfer, vol. 49, pp. 17-29, 2006.
-
(2006)
International Journal of Heat and Mass Transfer
, vol.49
, pp. 17-29
-
-
Meyer1
-
24
-
-
13444310690
-
Thermal issues in next-generation integrated circuits
-
Gurrum, et al., "Thermal issues in next-generation integrated circuits," IEEE Transactions on Device and Materials Reliability, vol. 4, pp. 709-714, 2004.
-
(2004)
IEEE Transactions on Device and Materials Reliability
, vol.4
, pp. 709-714
-
-
Gurrum1
-
25
-
-
0345134673
-
Boiling and Evaporation in Small Diameter Channels
-
Bergles, et al., "Boiling and Evaporation in Small Diameter Channels," Heat Transfer Engineering, vol. 24, pp. 18-40, 2003.
-
(2003)
Heat Transfer Engineering
, vol.24
, pp. 18-40
-
-
Bergles1
-
26
-
-
0037984655
-
Measurement and prediction of pressure drop in two-phase microchannel heat sinks
-
W. Qu and I. Mudawar, "Measurement and prediction of pressure drop in two-phase microchannel heat sinks," International Journal of Heat and Mass Transfer, vol. 46, pp. 2737-2753, 2003.
-
(2003)
International Journal of Heat and Mass Transfer
, vol.46
, pp. 2737-2753
-
-
Qu, W.1
Mudawar, I.2
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