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Volumn , Issue , 2008, Pages 510-519

Fluid-to-fluid spot-to-spreader (F2/S2) hybrid heat sink for integrated chip-level and hotspot-level thermal management

Author keywords

Hot spots; Liquid cooling

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COOLING; DYNAMICS; ELECTRONICS ENGINEERING; FIGHTER AIRCRAFT; FLUID DYNAMICS; FLUID MECHANICS; FLUXES; FORMING; HEAT FLUX; HEATING EQUIPMENT; INTEGRATED CIRCUITS; SPREADERS; THERMOMECHANICAL TREATMENT;

EID: 50949128289     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544311     Document Type: Conference Paper
Times cited : (14)

References (26)
  • 1
    • 0003352129 scopus 로고    scopus 로고
    • Thermal performance challenges from silicon to systems
    • Viswanath, et al., "Thermal performance challenges from silicon to systems," Intel Technology Journal, vol. 3, pp. 1-16, 2000.
    • (2000) Intel Technology Journal , vol.3 , pp. 1-16
    • Viswanath1
  • 2
    • 33845580323 scopus 로고    scopus 로고
    • Embedded thermoelectric coolers for semiconductor hot spot cooling
    • Koester, et al., "Embedded thermoelectric coolers for semiconductor hot spot cooling," ITHERM '06. 2006, pp. 491-496.
    • (2006) ITHERM '06 , pp. 491-496
    • Koester1
  • 3
    • 34548025127 scopus 로고    scopus 로고
    • On-chip hot spot cooling using silicon thermoelectric microcoolers
    • W. Peng and B.-C. Avram, "On-chip hot spot cooling using silicon thermoelectric microcoolers," Journal of Applied Physics, vol. 102, p. 034503, 2007.
    • (2007) Journal of Applied Physics , vol.102 , pp. 034503
    • Peng, W.1    Avram, B.-C.2
  • 4
    • 50949093590 scopus 로고    scopus 로고
    • Thin film thermoelectric cooler thermal validation and product thermal performance estimation
    • p. 6 pp
    • Sridhar, et al., "Thin film thermoelectric cooler thermal validation and product thermal performance estimation," ITHERM '06. 2006, p. 6 pp.
    • ITHERM '06 , pp. 2006
    • Sridhar1
  • 5
    • 33947242257 scopus 로고    scopus 로고
    • Direct liquid cooling of high flux micro and nano electronic components
    • Bar-Cohen, et al., "Direct liquid cooling of high flux micro and nano electronic components," Proceedings of the IEEE, vol. 94, pp. 1549-1570, 2006.
    • (2006) Proceedings of the IEEE , vol.94 , pp. 1549-1570
    • Bar-Cohen1
  • 7
    • 50949124534 scopus 로고    scopus 로고
    • Fluid-to-Fluid Spot-to-Spreader Heat Management Devices and Systems and Methods of Managing Heat
    • US Patent App. 60/954,360, 2007
    • A. G. Fedorov,"Fluid-to-Fluid Spot-to-Spreader Heat Management Devices and Systems and Methods of Managing Heat", US Patent App. 60/954,360, 2007.
    • Fedorov, A.G.1
  • 10
    • 0004245602 scopus 로고    scopus 로고
    • International Technology Roadmap for Semiconductors 2006 Update
    • "International Technology Roadmap for Semiconductors 2006 Update," 2006.
    • (2006)
  • 14
    • 0033743156 scopus 로고    scopus 로고
    • Optimization of Parallel Plate Heatsinks for Forced Convection
    • D. Copeland, "Optimization of Parallel Plate Heatsinks for Forced Convection," in Sixteenth IEEE SEMI-THERM Symposium, 2000.
    • (2000) Sixteenth IEEE SEMI-THERM Symposium
    • Copeland, D.1
  • 15
    • 0000351691 scopus 로고
    • New Correlations for Heat and Mass Transfer in Turbu-lent Pipe and Channel Flow
    • V. Gnielinski, "New Correlations for Heat and Mass Transfer in Turbu-lent Pipe and Channel Flow," Int. Chem. Eng, vol. 16, pp. 359-368, 1976.
    • (1976) Int. Chem. Eng , vol.16 , pp. 359-368
    • Gnielinski, V.1
  • 16
    • 29544435519 scopus 로고    scopus 로고
    • A Systematic Methodology for Optimal Design of Two-Phase Micro-Channel Heat Sinks
    • W. Qu and I. Mudawar, "A Systematic Methodology for Optimal Design of Two-Phase Micro-Channel Heat Sinks," Journal of Electronic Packaging, vol. 127, p. 381, 2005.
    • (2005) Journal of Electronic Packaging , vol.127 , pp. 381
    • Qu, W.1    Mudawar, I.2
  • 19
    • 0032076884 scopus 로고    scopus 로고
    • Prandtl number dependence of impingement heat transfer with circular free-surface liquid jets
    • Sun, et al., "Prandtl number dependence of impingement heat transfer with circular free-surface liquid jets," International Journal of Heat and Mass Transfer, vol. 41, pp. 1360-1363, 1998.
    • (1998) International Journal of Heat and Mass Transfer , vol.41 , pp. 1360-1363
    • Sun1
  • 20
    • 0037126920 scopus 로고    scopus 로고
    • A numerical study of the unsteady flow and heat transfer in a transitional confined slot jet impinging on an isothermal surface
    • V. A. Chiriac and A. Ortega, "A numerical study of the unsteady flow and heat transfer in a transitional confined slot jet impinging on an isothermal surface," International Journal of Heat and Mass Transfer, vol. 45, pp. 1237-1248, 2002.
    • (2002) International Journal of Heat and Mass Transfer , vol.45 , pp. 1237-1248
    • Chiriac, V.A.1    Ortega, A.2
  • 21
    • 23644434113 scopus 로고    scopus 로고
    • Optimized Heat Transfer for High Power Electronic Cooling Using Arrays of Microjets
    • M. Fabbri and V. K. Dhir, "Optimized Heat Transfer for High Power Electronic Cooling Using Arrays of Microjets," Journal of heat transfer, vol. 127, p. 760, 2005.
    • (2005) Journal of heat transfer , vol.127 , pp. 760
    • Fabbri, M.1    Dhir, V.K.2
  • 22
    • 31744436708 scopus 로고    scopus 로고
    • Effect of nozzle geometry on pressure drop and heat transfer in submerged jet arrays
    • A. Royne and C. J. Dey, "Effect of nozzle geometry on pressure drop and heat transfer in submerged jet arrays," International Journal of Heat and Mass Transfer, vol. 49, pp. 800-804, 2006.
    • (2006) International Journal of Heat and Mass Transfer , vol.49 , pp. 800-804
    • Royne, A.1    Dey, C.J.2
  • 23
    • 32144453365 scopus 로고    scopus 로고
    • Single-phase and two-phase cooling with an array of rectangular jets
    • Meyer, et al., "Single-phase and two-phase cooling with an array of rectangular jets," International Journal of Heat and Mass Transfer, vol. 49, pp. 17-29, 2006.
    • (2006) International Journal of Heat and Mass Transfer , vol.49 , pp. 17-29
    • Meyer1
  • 24
    • 13444310690 scopus 로고    scopus 로고
    • Thermal issues in next-generation integrated circuits
    • Gurrum, et al., "Thermal issues in next-generation integrated circuits," IEEE Transactions on Device and Materials Reliability, vol. 4, pp. 709-714, 2004.
    • (2004) IEEE Transactions on Device and Materials Reliability , vol.4 , pp. 709-714
    • Gurrum1
  • 25
    • 0345134673 scopus 로고    scopus 로고
    • Boiling and Evaporation in Small Diameter Channels
    • Bergles, et al., "Boiling and Evaporation in Small Diameter Channels," Heat Transfer Engineering, vol. 24, pp. 18-40, 2003.
    • (2003) Heat Transfer Engineering , vol.24 , pp. 18-40
    • Bergles1
  • 26
    • 0037984655 scopus 로고    scopus 로고
    • Measurement and prediction of pressure drop in two-phase microchannel heat sinks
    • W. Qu and I. Mudawar, "Measurement and prediction of pressure drop in two-phase microchannel heat sinks," International Journal of Heat and Mass Transfer, vol. 46, pp. 2737-2753, 2003.
    • (2003) International Journal of Heat and Mass Transfer , vol.46 , pp. 2737-2753
    • Qu, W.1    Mudawar, I.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.