Wafer-level thin-film encapsulation for MEMS

Microelectronic Engineering

Volumn 86, Issue 4-6, 2009, Pages 1311-1313

  O'Mahony, Conor ^a   Hill, Martin ^b   Olszewski, Zbigniew ^a   Blake, Alan ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

^b Department of Chemistry   (Ireland)

Author keywords

MEMS; Micromachining; Thin film encapsulation; Zero level packaging

Indexed keywords

CHANNEL DESIGNS; CMOS-COMPATIBLE; DEVICE PERFORMANCE; FIXED-FIXED BEAMS; INTEGRATED MEMS; LOW TEMPERATURES; LOW-TEMPERATURE MATERIALS; MICRO-ELECTRO MECHANICAL SYSTEMS; NOVEL PROCESS; PROCESS FLOWS; SACRIFICIAL LAYERS; THIN FILM ENCAPSULATION; THIN-FILM; WAFER LEVELS; WAFER-SCALE; ZERO-LEVEL PACKAGING;

COMPOSITE MICROMECHANICS; MEMS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SEMICONDUCTING SILICON COMPOUNDS; SILICA; SILICON COMPOUNDS; SILICON OXIDES; SILICON WAFERS; THIN FILM DEVICES; THIN FILMS;

ELECTRONICS PACKAGING;

EID: 67349110146     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.12.047     Document Type: Article

References (6)

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5. Olszewski Z., Hill M., O'Mahony C., et al. J. Micromech. Microeng. 15 (2005) S122-S131
6. M. Hill. Micromachined CMOS Compatible Tunable Capacitors, PhD. Thesis, National University of Ireland, Cork, 2007.