Debris-free in-air laser dicing for multi-layer MEMS by perforated internal transformation and thermally-induced crack propagation

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2008, Pages 822-827

  Izawa, Y ^a   Tanaka, S ^b   Kikuchi, H ^b   Tsurumi, Y ^a   Miyanaga, N ^a   Esashi, M ^b   Fujita, M ^c  

^a OSAKA UNIVERSITY   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

^c INSTITUTE FOR LASER TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACCIDENT PREVENTION; COMPOSITE MICROMECHANICS; CORUNDUM; CRACK PROPAGATION; DEBRIS; ISOMERS; LASERS; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; NEODYMIUM; OPTICAL DESIGN; REACTIVE ION ETCHING; SEPARATION; TECHNOLOGY;

FUNDAMENTAL WAVELENGTH; INDUCED CRACKS; INTERNATIONAL CONFERENCES; LASER DICING; MICRO-ELECTRO MECHANICAL SYSTEMS; MULTI LAYERING; ND : YAG LASERS; NON-CONTACT; SEPARATION PROCESSES; TI: SAPPHIRE LASERS;

PROCESS ENGINEERING;

EID: 50149118839     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2008.4443783     Document Type: Conference Paper

References (8)

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