Thin film encapsulation technology for harms using sacrificial CF-polymer

Sensors and Actuators, A: Physical

Volumn 145-146, Issue 1-2, 2008, Pages 316-322

  Reuter, D ^a   Bertz, A ^a   Nowack, M ^a   Gessner, T ^a,b  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

CF polymer; HARMS; Thin film encapsulation; Wafer level packaging

Indexed keywords

ASPECT RATIO; CMOS INTEGRATED CIRCUITS; COATINGS; COMPOSITE MICROMECHANICS; COMPUTER NETWORKS; CURVE FITTING; DIMENSIONAL STABILITY; ELECTROCHEMICAL SENSORS; ELECTROMECHANICAL DEVICES; ENCAPSULATION; FINITE DIFFERENCE METHOD; FINITE ELEMENT METHOD; LITHOGRAPHY; MEMS; MICROELECTROMECHANICAL DEVICES; OXYGEN; PHOTORESISTS; PLASMA (HUMAN); PLASMAS; POLYMERS; SOLIDS; STANDARDS; STRESSES; TECHNOLOGY; THICK FILMS; THIN FILM DEVICES; THIN FILMS;

(1 1 0) SURFACE; (ABIOTIC AND BIOTIC) STRESS; BONDING TECHNIQUES; CAPPING LAYER (GC LAYER); CHEMICAL VAPORS; DEFLECTION (OVALIZATION); DIE AREA; ELSEVIER (CO); FABRICATED STRUCTURES; FABRICATION TECHNOLOGIES; FINITE ELEMENT ANALYSIS (FEA); HIGH-ASPECT RATIO MICROSTRUCTURES (HARMST); INTERFEROMETRIC MEASUREMENTS; MECHANICAL STRESSING; MICRO ELECTRO MECHANICAL SYSTEMS (MEMS); NEW METHODS; ORGANIC LAYERS; OXYGEN PLASMAS; PACKAGING PROCESSES; PICK AND PLACE; PLASTIC INJECTION MOLDING (PIM); THIN FILM ENCAPSULATION; WIDE-RANGE;

PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

EID: 44849090943     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2007.11.002     Document Type: Article

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