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Volumn , Issue , 2009, Pages
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Modeling, simulation and calibration of the chip encapsulation molding process
a,b
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Author keywords
[No Author keywords available]
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Indexed keywords
CONCENTRATION OF;
CONVENTIONAL MODELS;
EXPERIMENTAL TEST;
FILLER PARTICLES;
GAS BUBBLE;
LOAD PARAMETERS;
MANUFACTURING EFFICIENCY;
MATERIAL SELECTION;
MICROELECTRONICS PACKAGES;
MICROELECTRONICS PACKAGING;
MOLD CAVITIES;
MOLD MATERIALS;
MOLDING PROCESS;
MOLDING TOOLS;
PARAMETER DEVIATIONS;
PROCESS CONDITION;
PRODUCT RELIABILITY;
SIMULATION ACCURACY;
TARGET VALUES;
TEST CONDITION;
TRANSIENT PROCESS;
VIRTUAL DESIGN;
CALIBRATION;
EXPERIMENTS;
FILLING;
GRAFTING (CHEMICAL);
MICROELECTRONICS;
MICROSYSTEMS;
MOLDING;
SYNTHESIS (CHEMICAL);
MOLDS;
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EID: 67650520399
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ESIME.2009.4938462 Document Type: Conference Paper |
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Times cited : (2)
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References (2)
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