Reliability in MEMS packaging

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2006, Pages 398-402

  Hsu, Tai Ran ^a  

^a SAN JOSE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENVIRONMENTAL CONDITIONS; MATERIAL CHARACTERIZATION; SUSTAINABLE PERFORMANCE;

COST EFFECTIVENESS; ELECTRONICS PACKAGING; MICROSYSTEMS; RELIABILITY; SEMICONDUCTOR DEVICE MANUFACTURE;

MEMS;

EID: 34250763173     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2006.251251     Document Type: Conference Paper

References (13)

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5. th Symposium on Mechanics of Surface Mount Assemblies, November 1999, pp. 1-8.
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11. Hsu, T.R. and Sun, N.S., "Residual Stresses/Strains analysis of MEMS," Proceedings of MSM '98, Santa Clara, California, April 6-8, 1998, pp. 82-87.
12. Madou, M., "Fundamentals of Microfabrications," CRC Press, Boca Raton, 1997.
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