Stable thin film encapsulation of acceleration sensors using polycrystalline silicon as sacrificial and encapsulation layer

Sensors and Actuators, A: Physical

Volumn 114, Issue 2-3, 2004, Pages 355-361

  Höchst, Arnim ^a   Scheuerer, Roland ^a   Stahl, Heiko ^a   Fischer, Frank ^a   Metzger, Lars ^a   Reichenbach, Ralf ^a   L̈arner, Franz ^a   Kronmüller, Silva ^a   Watcham, Stuart ^b   Rusu, Cristina ^c   Witvrouw, Ann ^c   Gunn, Robert ^d  

^a ROBERT BOSCH GMBH   (Germany)

^b Surface Technology Systems Plc   (United Kingdom)

^c IMEC   (Belgium)

^d NONE

Author keywords

Accelerometer; Encapsulation; Packaging; Sacrificial etching; Surface micromachining

Indexed keywords

ACCELERATION MEASUREMENT; CMOS INTEGRATED CIRCUITS; ENCAPSULATION; ETCHING; MICROELECTROMECHANICAL DEVICES; OXIDES; PACKAGING; POLYSILICON; SENSORS; SILICON WAFERS; THICKNESS CONTROL;

ACCELEROMETER; PLASTIC MOULD; SACRIFICIAL ETCHING; SURFACE MICROMACHINING;

THIN FILMS;

EID: 4344692139     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2003.12.020     Document Type: Article

References (12)

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