Effect of oxygen on the thermomechanical behavior of passivated Cu thin films

Journal of Materials Research

Volumn 18, Issue 9, 2003, Pages 2122-2134

  Shu, Jonathan B ^a   Clyburn, Susan B ^a   Mates, Thomas E ^b   Baker, Shefford P ^a  

^a Cornell University   (United States)

^b University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DEFORMATION; FILM PREPARATION; INTERFACES (MATERIALS); MECHANICAL PROPERTIES; OXYGEN; PASSIVATION; SECONDARY ION MASS SPECTROMETRY; SILICON; SUBSTRATES; THERMAL CYCLING; THERMODYNAMIC PROPERTIES;

COPPER THIN FILM; DIFFUSION-INDUCED DISLOCATION; INTERFACIAL ADHESION; THERMOMECHANICAL BEHAVIOUR;

THIN FILMS;

EID: 0141705187     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2003.0298     Document Type: Article

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