Isothermal stress relaxation in electroplated Cu films. II. Kinetic modeling

Journal of Applied Physics

Volumn 97, Issue 10, 2005, Pages

  Huang, Rui ^a   Gan, Dongwen ^b   Ho, Paul S ^b  

^a The University of Texas at Austin   (United States)

^b UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACE DIFFUSION; ISOTHERMAL STRESS RELAXATION; KINETIC MODELING; SURFACE DIFFUSIVITY;

COPPER; DIFFUSION; ELECTROMIGRATION; ELECTROPLATING; INTERFACES (MATERIALS); MASS TRANSFER; MATHEMATICAL MODELS; METALLIC FILMS; REACTION KINETICS; THERMAL CYCLING; THERMAL STRESS; THIN FILMS;

STRESS RELAXATION;

EID: 20944432896     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1904721     Document Type: Article

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