Anisotropy and texture in thin copper films - An elasto-plastic analysis

Acta Materialia

Volumn 50, Issue 4, 2002, Pages 857-870

  Wikstrom A ^a   Nygards M ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Copper; Strain hardening; Texture; Theory modelling; Thin films

Indexed keywords

ANISOTROPY; COPPER; ELASTOPLASTICITY; LOADS (FORCES); POLYIMIDES; SILICON; STRAIN HARDENING; SUBSTRATES; TEXTURES;

ELASTIC ANISOTROPY; TENSILE LOADING;

METALLIC FILMS;

EID: 0037169853     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(01)00358-5     Document Type: Article

References (22)

1. Stress evolution in passivated thin films of Cu on silica substrates
2. Stress-temperature behaviour of unpassivated thin copper films
3. Yield stress in single crystal and polycrystalline Al films
4. Stress and plasticity in Cu thin films
5. Micro-tensile and fatigue testing of copper thin films on substrates
6. Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers
7. Thermomechanical behavior of different texture components in Cu thin films
8. X-ray diffraction as a tool to study the mechanical behaviour of thin films
9. Deformation behavior of thin copper films on deformable substrates
10. Tensile testing of AlCu thin films on polyimide foils
11. Micromechanical modeling of ferritic/pearlitic steels
12. The role of texture on the reliability of aluminum-based interconnects
13. Texture and microstructure of thin copper films
14. Textures of thin copper films
15. Determination of internal stresses in cyclically deformed copper single crystals using convergent-beam electron diffraction and dislocation dipole separation measurements
16. Spectral decomposition of the elasticity tensor