Trend from ICs to 3D ICs to 3D systems

Proceedings of the Custom Integrated Circuits Conference

Volumn , Issue , 2009, Pages 439-444

  Tummala, Rao R ^a   Sundaram, Venky ^a   Chatterjee, Ritwik ^a   Markondeya Raj, P ^a   Kumbhat, Nitesh ^a   Sukumaran, Vijay ^a   Sridharan, Vivek ^a   Choudury, Abhishek ^a   Chen, Qiao ^a   Bandyopadhyay, Tapobrata ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D ICS; 3D SYSTEMS; ALTERNATIVE PATH; ENTIRE SYSTEM; FINE PITCH; IC INDUSTRY; MINIATURIZATION TECHNOLOGIES; MOORE'S LAW; NANO SCALE; SYSTEM INTERCONNECTIONS; THERMAL MATERIALS; TOTAL BENEFITS; TRANSISTOR CHIPS; WAFER LEVEL;

ELECTRONIC EQUIPMENT MANUFACTURE; INTEGRATED CIRCUITS; MINIATURE INSTRUMENTS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

THREE DIMENSIONAL;

EID: 74249100442     PISSN: 08865930     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CICC.2009.5280817     Document Type: Conference Paper

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