Integrating high-k ceramic thin film capacitors into organic substrates via low-cost solution processing

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 4, 2007, Pages 585-594

  Raj, P Markondeya ^a   Balaraman, Devarajan ^b   Abothu, Isaac Robin ^a   Yoon, Chong ^a   Kang, Nam Kee ^c   Tummala, Rao ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b INTEL CORPORATION   (United States)

^c Korea Electronic Technology Institute (KETI)   (South Korea)

Author keywords

Capacitors; Decoupling; Embedded; Embedded systems; Hydrothermal; Organic; Sol gel; Sol gel processing; Substrates

Indexed keywords

CAPACITANCE; CERAMIC MATERIALS; ELECTRIC BREAKDOWN; EMBEDDED SYSTEMS; HIGH TEMPERATURE PROPERTIES; MICROPROCESSOR CHIPS; PERMITTIVITY; THIN FILMS; VACUUM TECHNOLOGY;

CAPACITANCE DENSITIES; CERAMIC THIN FILM CAPACITORS; DECOUPLING;

CAPACITORS;

EID: 36849028571     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.901737     Document Type: Conference Paper

References (23)

1. R. K. Ulrich and L. W. Schaper, Integrated Passive Component Technology. New York: Wiley, 2003.
2. T. Shioga, J. D. Baniecki, Y. Ishizuki, M. Mizukoshi, and K. Kurihara, "Integration of thin film capacitors on organic laminates for systems in package applications," presented at the The IMAPS Advanced Passives Workshop, Jan. 2005.
3. K. Kurihara, T. Shioga, and J. D. Beniecki, "Electrical properties of low-inductance barium strontium titanate thin film decoupling capacitors," J. Eur. Ceram. Soc., vol. 24, no. 6, pp. 1873-1876, 2004.
4. J. Takafuji, S. Konushi, H. Nakashima, S. Ueda, F. Fukumaru, and S. Nambu, "Thin film low inductance decoupling device for high speed digital circuits," in Proc. 54th Electron. Comp. Technol. Conf., 2004, pp. 277-281.
5. S. Yamamichi and A. Shibuya, "Novel flexible and thin capacitors with Mn-doped SrTiO/sub 3/thin films on polyimide films," in Proc. 54th Electron. Comp. Technol. Conf., 2004, pp. 271-276.
6. 3 thin films electron-cyclotron-resonance-sputtered at 400 degrees C," J. Electrochem., vol. 144, no. 12, pp. 4321-4325, 1997.
7. W. Borland, J. Felten, L. Dellis, S. Ferguson, D. Majumdar, A. Jones, M. Lux, R. Traylor, and M. Doyle, "Ceramic resistors and capacitors embedded in organic printed wiring boards," in Proc. Int. Electron. Packag. Tech. Conf. Exhibition, 2003.
8. 3 thin films on < 100 > oriented nickel tapes," Appl. Phys. Lett., vol. 81, no. 16, pp. 3206-3028, 2002.
9. J. A. Andresakis, E. Skorupski, W. Herrick, and M. D. Woodry, "Nickel coated copper as electrodes for embedded passives devices," U.S. Patent 6 610 417, 2003.
10. T. Kim, A. I. Kingon, J.-P. Maria, and R. T. Croswell, "Ca-doped lead zirconate titanate thin film capacitors on base metal nickel on copper foil," J. Mater. Res., vol. 19, no. 10, pp. 2841-2848, 2004.
11. J. F. Ihiefeld, A. Kingon, W. Borland, and J. P. Maria, "Cu-compatible ultrahigh permittivity dielectrics for embedded passive components," in Proc. Mater. Res. Soc. Symp., 2004, vol. 783, pp. 145-50.
12. 3 films," J. Amer. Ceram. Soc., vol. 79, no. 1, pp. 239-247, 1997.
13. H. Xu and L. Gao, "New evidence of a dissolution precipitation mechanism in hydrothermal synthesis of barium titanate powders," Mater. Lett., vol. 57, no. 2, pp. 490-494, Dec. 2002.
14. M. Dogan and F. Sarikaya, "Mechanisms of hydrothermal barium titanate thin film formation," in Proc. Mater. Res. Soc. Symp., Polycrystall. Thin Films: Struct., Texture, Properties, Appl., 1996, vol. 403, pp. 95-99.
15. F. K. Detlev, C. M. Hennings, and B. S. Schreinemacher, "Defect chemistry and microstructure of hydrothermal barium titanate," J. Amer. Ceram. Soc., vol. 84, no. 1, pp. 179-182, 2001.
16. 3 films grown under hydrothermal conditions," Appl. Surf. Sci., vol. 134, no. 1-4, pp. 225-228, 1998.
17. S. K. Paul and M. N. Rahaman, "Characterization of epitaxial barium titanate films deposited under hydrothermal conditions," in Proc. Ceram. Eng. Sci., 2003, vol. 24, no. 3, p. 111.
18. J. G. Lisoni, F. G. Piera, M. Sa'nchez, C. F. Soto, and V. M. Fuenzalida, "Water incorporation in BaTiO films grown under hydrothermal conditions," Appl. Surf. Sci., vol. 134, pp. 225-228, 1998.
19. 3 thin films," Vacuum, vol. 48, no. 2, pp. 161-164, Feb. 1997.
20. 3 crystals," Solid State Commun., vol. 32, no. 9, pp. 771-775, Dec. 1979.
21. M. A. McCormick and E. B. Slamovich, "Effect of precursor pyrolysis on the dielectric properties of hydrothermally derived barium titanate thin films," J. Amer. Ceram. Soc., vol. 83, no. 2, pp. 442-444, Feb. 2000.
22. J. F. Scott, "High dielectric constant thin films for dynamic random access memories (DRAM)," Annu. Rev. Mater. Sci., vol. 28, pp. 79-100, 1998.
23. V. Sundaram, R. Tummala, B. Wiedenman, F. Liu, P. Markondeya-Raj, I. R. Abothu, S. Bhattacharya, M. Swaminathan, E. Bongio, and W. Sherwood, "Recent advances in low CTE and high-density system-on-a-package substrate with thin film component," in Proc. 56th Electron. Comp. Technol. Conf., San Diego, CA, May 28-30, 2006, pp. 1375-1380.