Highly-reliable, 30μm pitch copper interconnects using nano-ACF/NCF

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1479-1485

  Kumbhat, Nitesh ^a   Choudhury, Abhishek ^a   Raine, Melanie ^a   Mehrotra, Gaurav ^a   Raj, P Markondeya ^a   Zhang, Rongwei ^a   Moon, Kyoung S ^a   Chatterjee, Ritwik ^a   Sundaram, Venky ^a   Meyer Berg, Georg ^b   Wong, C P ^a   Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE MATERIALS; ANISOTROPIC CONDUCTIVE FILMS; COPPER INTERCONNECTS; DAISY-CHAIN RESISTANCE; ELECTRICAL PERFORMANCE; FLIP CHIP; FLIP-CHIP PACKAGING; HIGH TEMPERATURE STORAGE LIVES; HIGHLY ACCELERATED STRESS TESTS; INSULATION RESISTANCE; INTERCONNECT RELIABILITY; INTERCONNECT RESISTANCE; NON-CONDUCTIVE FILM; NOVEL ADHESIVES; ORGANIC PACKAGES; ORGANIC SUBSTRATE; PACKAGE LEVELS; PORTABLE ELECTRONICS; RELIABILITY CRITERION; RELIABILITY PERFORMANCE; STRESS-STRAIN; SYSTEM APPROACH; TEST RESULTS; TEST VEHICLE; THERMAL CYCLING TEST; ULTRA FINE PITCH; ULTRA-FINES; UNDERFILLS;

AUTOMOBILE ELECTRONIC EQUIPMENT; AUTOMOBILE PARTS AND EQUIPMENT; CHIP SCALE PACKAGES; CONDUCTIVE FILMS; COPPER; ELECTRIC BATTERIES; ELECTRONIC EQUIPMENT; HIGH TEMPERATURE SUPERCONDUCTORS; INTEGRATED CIRCUITS; OPTICAL INTERCONNECTS; RELIABILITY; SOLDERING ALLOYS; SUBSTRATES;

TESTING;

EID: 70349686459     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074208     Document Type: Conference Paper

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