Multilayer thin-film technology enabling technology for solving high-density interconnect and assembly problems

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 509, Issue 1-3, 2003, Pages 191-199

  Beyne, Eric ^a  

^a IMEC   (Belgium)

Author keywords

CSP; Flip chip; MCM; Multilayer thin film; RF

Indexed keywords

FLIP CHIP DEVICES; INTEGRATED CIRCUITS; MICROELECTRONICS; MULTILAYERS;

MULTILAYER THIN FILMS;

THIN FILMS;

EID: 0042729971     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-9002(03)01570-5     Document Type: Conference Paper

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