Wafer level package using double balls

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 198-200

  Toepper, M ^a   Glaw, V ^a   Coskina, P ^a   Auersperg, J ^a   Samulewicz, K ^a   Lange, M ^a   Karduck, C ^a   Fehlberg, S ^a   Ehrmann, O ^a   Reichl, H ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC HUMIDITY; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; RELIABILITY; SOLDERING; SOLDERING ALLOYS; STRESS ANALYSIS;

SOLDER BALL ARRAYS; STRESS COMPENSATION LAYER (SCL);

MICROPROCESSOR CHIPS;

EID: 0033717735     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)