Thermo-mechanical design for reliability of WLPs with compliant interconnects

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 1, Issue , 2005, Pages 328-334

  Dudek, Rainer ^a   Walter, Hans ^a   Doering, Ralf ^a   Michel, Bernd ^a   Meyer, Thorsten ^b   Zapf, Joerg ^c   Hedler, Harry ^b  

^a FRAUNHOFER IZM   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

^c SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BUMP CONTACT SYSTEM; ELASTIC INTERCONNECTS; THERMAL EXPANSION COEFFICIENTS; THERMOMECHANICAL DESIGN;

ELECTRODEPOSITION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; METALLIC FILMS; RELIABILITY THEORY; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 33847286024     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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3. Schubert, A., Dudek, R., E. Auerswald, A. Gollhardt, B. Michel, H. Reichl, "Fatigue Life Models for SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulation", Proceedings, 53rd Electronic Components & Technology Conference, 2003, pp. 603-610
4. Dudek, R., Walter, H., Döring, R., Michel, B., "Thermal Fatigue Modelling for SnAgCu and SnPb Solder Joints". Proceedings EuroSimE 2004, Brussels, Belgium, May 2004, pp. 557-564
5. W. Engelmaier, "Manufacturing and Reliability Issues of Small-Diameter/High-Aspect-Ratio Plated Through-Holes Vias," Short Course Proceeding, IZM-ZVE, Oberpfaffenhofen. 1994
6. Hommel, M., Kraft, O., "Deformation Behavior of Thin Copper Films on Deformable Substrates," Acta mater., 49 (2001), pp. 3925-3947
7. th EuroSimE, Aix, 2003, pp. 133-139