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Volumn 460, Issue 1-2, 2008, Pages 594-598
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Effect of Zn addition on the formation and growth of intermetallic compound at Sn-3.5 wt% Ag/Cu interface
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Author keywords
Intermetallics; Metals and alloys; Microstructure; Solid state reaction
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Indexed keywords
DIFFUSION;
GROWTH RATE;
INTERFACES (MATERIALS);
MICROSTRUCTURE;
SOLDERING ALLOYS;
SOLID STATE REACTIONS;
TIN COMPOUNDS;
DIFFUSION RATE;
EUTECTIC SOLDER;
INTERFACIAL PRODUCT;
INTERMETALLICS;
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EID: 44449102607
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2007.06.031 Document Type: Article |
Times cited : (26)
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References (23)
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