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Volumn 460, Issue 1-2, 2008, Pages 594-598

Effect of Zn addition on the formation and growth of intermetallic compound at Sn-3.5 wt% Ag/Cu interface

Author keywords

Intermetallics; Metals and alloys; Microstructure; Solid state reaction

Indexed keywords

DIFFUSION; GROWTH RATE; INTERFACES (MATERIALS); MICROSTRUCTURE; SOLDERING ALLOYS; SOLID STATE REACTIONS; TIN COMPOUNDS;

EID: 44449102607     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.06.031     Document Type: Article
Times cited : (26)

References (23)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.