Thermal degradation of electroplated nickel thermal microactuators

Journal of Microelectromechanical Systems

Volumn 18, Issue 6, 2009, Pages 1279-1287

  Luo, J K ^a   Fu, Y Q ^b   Williams, J A ^c   Milne, W I ^c  

^a UNIVERSITY OF BOLTON   (United Kingdom)

^b HERIOT WATT UNIVERSITY   (United Kingdom)

^c UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

Back bending; Electroplating; Oxidation; Plastic deformation; Thermal actuator; Thermal degradation

Indexed keywords

AVERAGE TEMPERATURE; BACK BENDING; BACKWARD DISPLACEMENTS; CRITICAL POWER; ELECTROPLATED NICKEL; ENERGY DISPERSIVE X-RAY DIFFRACTIONS; MAXIMUM DISPLACEMENT; MAXIMUM TEMPERATURE; PULSE SIGNAL; SILICON-BASED; THERMAL ACTUATOR; THERMAL DEGRADATIONS; THERMAL MICROACTUATORS; VOLTAGE AMPLITUDE;

BENDING (DEFORMATION); DEGRADATION; ELECTROPLATING; MICROACTUATORS; NICKEL; NICKEL ALLOYS; NICKEL PLATING; OXIDATION; PHOTORESISTS; PLASTIC DEFORMATION; PLASTICS; SCANNING ELECTRON MICROSCOPY; SURFACE MICROMACHINING; TENSILE STRESS; THERMOGRAVIMETRIC ANALYSIS; X RAY DIFFRACTION ANALYSIS;

PHOTODEGRADATION;

EID: 71549127475     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2009.2034394     Document Type: Article

References (31)

1. J. R. Reid, V. M. Bright, and J. H. Comtois, "Force measurements of polysilicon thermal micro-actuators," Proc. SPIE, vol.2882, pp. 296-306, 1996.
2. T. Moulton and G. K. Ananthasuresh, "Micromechanical devices with embedded electro-thermal-compliant actuation," Sens. Actuators A, Phys., vol. 90, no. 1/2, pp. 38-48, May 2001.
3. Q. A. Huang and N. K. Lee, "Analysis and design of polysilicon thermal flexure actuator," J. Micromech. Microeng., vol.9, no.1, pp. 64-70, Mar. 1999.
4. R. L. Borwick, P. A. Stupar, and J. DeNatale, "A hybrid approach to low-voltage MEMS switches," in Proc. 12th Int. Conf. Transducer, Solid-State Sens., Actuators Microsyst., 2003, vol.1, pp. 859-862.
5. J. H. Comtois and V. M. Bright, "Applications for surface-micromachined polysilicon thermal actuators and arrays," Sens. Actuators A, Phys., vol.58, no.1, pp. 19-25, Jan. 1997.
6. S. Deladi, G. Krijnen, and M. Elwenspoek, "Distinction of the irreversible and reversible actuation regions of B-doped poly-Si based electrothermal actuators," J. Micromech. Microeng., vol.14, no.9, pp. S31-S36, Sep. 2004.
7. J. Bagdahn and W. N. Sharp, "Fracture strength of polysilicon at stress concentration," J. Microelectromech. Syst., vol.12, no.3, pp. 302-312, Jun. 2003.
8. J. M. Maloney, D. S. Schreiber, and D. L. DeVoe, "Large-force electrothermal liner micromotors," J. Micromech. Microeng., vol.14, no.2, pp. 226-234, Feb. 2004.
9. R. A. Conant and R. S. Muller, "Cyclic fatigue testing of surface-micromachined thermal actuators," in Proc. Amer. Soc. Mech. Eng., 1998, vol.DSC-V.66, pp. 273-277.
10. S. Nakao, T. Ando, M. Shikeda, and K. Sato, "Mechanical properties of a micron-sized SCS film in a high-temperature environment," J. Micromech. Microeng., vol.16, no.4, pp. 715-720, Apr. 2006.
11. A. Tuck, A. Jungen, A. Geisberger, M. Ellis, and G. Skidmore, "A study of creep in polysilicon MEMS devices," J. Eng. Mater. Technol., vol.127, no.1, pp. 90-96, Jan. 2005.
12. J. K. Luo, J. H. He, A. J. Flewitt, D. F. Moore, S. M. Spearing, N. A. Fleck, and W. I. Milne, "Development of all metal electro-thermal actuators and its applications," J. Microlith. Microfab. Microsyst., vol.4, no.2, p. 023012-23021, 2005.
13. P. M. Zavracky, S. Majumder, and N. E. McGruer, "Micromechani-cal switches fabricated using nickel surface micromachining," J. Micro-electromech. Syst., vol.6, no.1, pp. 3-9, Mar. 1997.
14. I. Schiele, J. Huber, B. Hillerich, and F. Kozlowski, "Surface-micromachined electrostatic microrelay," Sens. Actuators A, Phys., vol.66, no.1-3, pp. 345-354, Apr. 1998.
15. J. S. Lee, S. D. Park, A. K. Nallani, G. S. Lee, and J. B. Lee, "Sub-micron metallic electrothermal actuators," J. Micromech. Microeng., vol.15, no.2, pp. 322-327, Feb. 2005.
16. D. A. Fanner and R. A. F. Hammond, "The properties of nickel electrodeposited from a sulphamate bath," Trans. Inst. Met. Finish., vol.36, pp. 32-42, 1959.
17. L. S. Stephens, K. W. Kelly, S. Simhadri, A. B. McCandless, and E. I. Meletis, "Mechanical property evaluation and failure analysis of cantilevered LIGA nickel microposts," J. Microelectromech. Syst., vol.10, no.3, pp. 347-359, Sep. 2001.
18. F. Wang, R. Cheng, and X. Li, "MEMS vertical probe cards with ultra densely arrayed metal probes for wafer-level IC testing," J. Microelectro-mech. Syst., vol.18, no.4, pp. 933-941, Aug. 2009.
19. R. V. Shenoy and M. Datta, "Effect of mask wall angle on shape evolution during through-mask electrochemical micromachining," J. Electrochem. Soc., vol.143, no.2, pp. 544-552, 1996.
20. J. K. Luo, D. P. Chu, A. J. Flewitt, S. M. Spearing, N. A. Fleck, and W. I. Milne, "Uniformity control of Ni thin film microstructure deposited by through-mask plating," J. Electrochem. Soc., vol.152, no.1, pp. C36-C41, 2005.
21. J. K. Luo, A. J. Flewitt, S. M. Spearing, N. A. Fleck, and W. I. Milne, "Comparison of microtweezers based on three lateral thermal actuator configurations," J. Micromech. Microeng., vol.15, no.6, pp. 1294-1302, Jun. 2005.
22. J. K. Luo, A. J. Flewitt, S. M. Spearing, N. A. Fleck, and W. I. Milne, "Three types of planar structure microspring electro-thermal actuators with insulating beam constraint," J. Micromech. Microeng., vol.15, no.8, pp. 1527-1535, Aug. 2005.
23. J. K. Luo, M. Pritschow, A. J. Flewitt, S. M. Spearing, N. A. Fleck, and W. I. Milne, "Effects of process conditions on properties of electroplated Ni thin films for microsystems applications," J. Electrochem. Soc., vol.153, no.10, pp. D155-D161, 2005.
24. E. T. Enikov and K. Lazarov, "PCB-integrated metallic thermal micro-actuators," Sens. Actuators A, Phys., vol.105, no.1, pp. 76-82, Jun. 2003.
25. R. Hickey, D. Sameoto, T. Hubbard, and M. Kujath, "Time and frequency response of two-arm micromachined thermal actuators," J. Micromech. Microeng., vol.13, no.1, pp. 40-46, Jan. 2003.
26. R. Kickey, M. Kujath, and T. Hubbard, "Heat transfer analysis and optimization of two-beam microelectromechanical thermal actuators," J. Vac. Sci. Technol. A, Vac. Surf. Films, vol.20, no.3, pp. 971-974, May 2002.
27. Z. Budrovic, H. V. Swygenhoven, P. M. Derlet, S. V. Petegem, and B. Schmitt, "Plastic deformation with reversible peak broadening in nanocrystalline nickel," Science, vol.304, no.5668, pp. 273-276, Apr. 2004.
28. X. Z. Liao, A. R. Kilmametov, R. Z. Valiev, H. Gao, X. Li, A. K. Mukherjee, J. F. Binger, and Y. T. Zhu, "High-pressure torsion-induced grain growth in electrodeposited nanocrystalline Ni," Appl. Phys. Lett., vol.88, no.21, p. 021909, May 2006.
29. G. J. Fan, Y. D. Wang, L. F. Fu, H. Choo, P. K. Liaw, Y. Ren, and N. D. Browning, "Orientation-dependent grain growth in a bulk nanocrys-talline alloy during the uniaxial compressive deformation," Appl. Phys. Lett., vol.88, no.17, p. 171914, Apr. 2006.
30. S. C. Chang, J. M. Shieh, B. T. Dai, M. S. Feng, and Y. H. Li, "The effect of plating current density on self-annealing behaviours of electroplated copper film," J. Electrochem. Soc., vol.149, no.9, pp. G535-G538, 2002.
31. W. H. Safranek, "Structure and property relationship for bulk electrode-posits," J. Vac. Sci. Technol., vol.11, no.4, pp. 765-770, 1974%.