A study of creep in polysilicon MEMS devices

Journal of Engineering Materials and Technology

Volumn 127, Issue 1, 2005, Pages 90-96

  Tuck, K ^a   Jungen, A ^a   Geisberger, A ^a   Ellis, M ^a   Skidmore, G ^a  

^a ZYVEX CORPORATION   (United States)

Author keywords

Creep Measurements; High Temperature Plastic Deformation; Polysilicon Material Properties

Indexed keywords

CREEP; MATHEMATICAL MODELS; MELTING; PLASTIC DEFORMATION; POLYSILICON; STRESS ANALYSIS; THERMAL EFFECTS; THIN FILMS;

CREEP MEASUREMENT; HIGH TEMPERATURE PLASTIC DEFORMATION; MICRO-ACTUATORS; POLYSILICON MATERIAL PROPERTIES;

MICROELECTROMECHANICAL DEVICES;

EID: 15844379906     PISSN: 00944289     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1839214     Document Type: Conference Paper

References (20)

1. Ballarini, R., Kahn, H., Tayebi, N., and Heuer, A. H., 2001, "Effects of Microstructure on the Strength and Fracture Toughness of Polysilicon: A Wafer Level Testing Approach," Mechanical Properties of Structural Films, ASTM STP 1413, C. L. Muhlstein and S. B. Brown, eds., ASTM, West Conshohocken, PA, online, available: www.astm.org/STP/1413/1413_13, 15 June 2001.
2. Callister, J. W. D., 1994, Material Science and Engineering, John Wiley and Sons, Inc., New York.
3. Comtois, J., and Bright, V., 1997, "Applications for Surface-Micromachined Polysilicon Thermal Actuators and Arrays," Sens. Actuators, A, 57, pp. 19-25.
4. Sharpe, Jr., W. N., Bagdahn, J., Jackson, K., and Coles, G., 2003, "Tensile Testing of MEMS Materials - Recent Progress," J. Mater. Sci., 38, pp. 4075-4079.
5. LaVan, D. A., Tsuchiya, T., Coles, G., Knauss, W. G., Chasiotis, I., and Read, D., 2001, "Cross Comparison of Strength Testing Techniques on Polysilicon Films," ASTM STP 1413, C. Muhlstein and S. B. Brown, eds., American Society for Testing and Materials, West Conshohocken, PA, online, available www.astm.org/STP/1413/1413.06, 10 April, 2001.
6. Sharpe, Jr., W. N., Vaidyanathan, R., Yuan, B., Bao, G., and Edwards, R. L., 1997, "Effect of Etch Holes on the Mechanical Properties of Silicon," J. Vac. Sci. Technol. B, 15, p. 1599.
7. Allameh, S. M., 2003, "An Introduction to Mechanical-Properties- Related Issues in MEMS Structures," Mechanical Properties of MEMS Structures. Journal of Materials Science 38, pp. 4115-4123, Department of Mechanical and Aerospace Engineering, The Princeton Materials Institute Princeton, NJ 08544, USA.
8. Haque, M. A., and Saif, M. T. A., 2003, "A Review of MEMS-Based Microscale and Nanoscale Tensile and Bending Testing," Society for Experimental Mechanics. Vol. 43, No. 3, September 2003, pp. 248-255.
9. Espinosa, H. D., Prorok, B. C., and Fisher, M., 2003, "A Methodology for Determining Mechanical Properties of Freestanding Then Films and MEMS Materials," J. Mech. Phys. Solids, 51, pp. 47-67.
10. Zupan, M., Hayden, M. J., Boehlert, C. J., and Hemker, K. J., 2001, "Development of High-Temperature Microsample Testing," Exp. Mech., 41, pp. 1-6.
11. Koester, D., Mahadevan, R., Hardy, B., and Markus, K., MUMPs Design Handbook, Cronos Integrated Microsystems, Morrisville, NC, 2000.
12. Yu, C. L., Flinn, P. A., Lee, S. H., and Bravman, J. C., 1997, "Stress and Microstructural Evolution of LPCVD Polysilicon Thin Films During High Temperature Annealing," Mater. Res. Soc. Symp. Proc., 441, pp. 403-408.
13. Geisberger, A., Sarkar, N., Ellis, M., and Skidmore, G., 2003, "Electrothermal Properties and Modeling of Polysilicon Microthermal Actuators," J. Microelectromech. Syst., 12, pp. 513-523.
14. Yang, E.-K, and Fujita, H., 1997, "Determination of the Modification of Young's Modulu s Due to Joule Heating of Polysilicon Micro Structures Using u-Shaped Beams," Sens. Actuators, A, 70, pp. 175-190.
15. Mermelstein, M., UMECH Manual, UMECH Technologies LLC, 2001.
16. Davis and Reynolds, 1996, Structural Geology of Rocks and Regions, John Wiley and Sons, Inc.
17. Frost, H. J., and Ashby, M. F., Year, "The Plasticity and Creep of Metals and Ceramics," Deformation-Mechanism Maps, Dartmouth College, USA and Cambridge University, UK. Available online: http://thayer.dartmouth.edu/ ~defmech/.
18. Conant, R., and Muller, R., 1997, "Cyclic Fatigue Testing of Surface-Micromachined Thermal Actuators," in ASME Internation Mechanical Engineering Congress and Exposition, Anaheim, CA, pp. 273-277.
19. Rybicki, G. C., and Pirouz, P., 1988, "Indentation Plasticity and Fracture in Silicon," NASA Technical Paper 2863.
20. Yangand, E.-H., and Fujita, H., 1999, "Reshaping of Single-Crystal Silicon Microstructures," Jpn. J. Appl. Phys., 37, pp. 1570-1573.