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Volumn 152, Issue 1, 2005, Pages
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Uniformity control of Ni thin-film microstructures deposited by through-mask plating
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Author keywords
[No Author keywords available]
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Indexed keywords
CHEMICAL MECHANICAL POLISHING;
CURRENT DENSITY;
ELECTROPHORESIS;
ELECTROPLATING;
HIGH TEMPERATURE EFFECTS;
METALLIC FILMS;
MICROELECTROMECHANICAL DEVICES;
MICROELECTRONICS;
MICROSTRUCTURE;
NICKEL;
PHOTORESISTS;
SPUTTERING;
THERMAL EFFECTS;
ELECTROPLATED METAL FILMS;
FLUIDIC FRICTION EFFECT;
MICROELECTROMECHANICAL SYSTEM (MEMS);
THIN-FILM MICROSTRUCTURES;
THIN FILMS;
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EID: 12744269328
PISSN: 00134651
EISSN: None
Source Type: Journal
DOI: 10.1149/1.1833320 Document Type: Article |
Times cited : (62)
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References (18)
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