메뉴 건너뛰기




Volumn 143, Issue 2, 1996, Pages 544-549

Effect of mask wall angle on shape evolution during through-mask electrochemical micromachining

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; BOUNDARY ELEMENT METHOD; DISSOLUTION; ELECTRIC CURRENT DISTRIBUTION; ELECTRODES; ETCHING; LAPLACE TRANSFORMS; MATHEMATICAL MODELS; METALS; MICROMACHINING;

EID: 0030082323     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1836477     Document Type: Article
Times cited : (50)

References (13)
  • 7
    • 0345641671 scopus 로고
    • M. Datta, K. Sheppard, and D. Snyder, Editors, PV 92-3, The Electrochemical Society Proceedings Series, Pennington, NJ
    • M. Datta, in Electrochemical Microfabrication, M. Datta, K. Sheppard, and D. Snyder, Editors, PV 92-3, p. 61, The Electrochemical Society Proceedings Series, Pennington, NJ (1992).
    • (1992) Electrochemical Microfabrication , pp. 61
    • Datta, M.1
  • 9
    • 3743139005 scopus 로고
    • L. T. Romankiw, M. Datta, T. Osaka, and Y. Yamazaki, Editors, PV 93-20, The Electrochemical Society, Proceedings Series, Pennington, NJ
    • M. Datta and L. T. Romankiw, in Electrochemical Technology Applications in Electronics, L. T. Romankiw, M. Datta, T. Osaka, and Y. Yamazaki, Editors, PV 93-20, p. 123, The Electrochemical Society, Proceedings Series, Pennington, NJ (1993).
    • (1993) Electrochemical Technology Applications in Electronics , pp. 123
    • Datta, M.1    Romankiw, L.T.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.