Electromigration study of 50 μm pitch micro solder bumps using four-point kelvin structure

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 930-935

  Yu, Da Quan ^a   Chai, Tai Chong ^a   Thew, Meei Ling ^a   Ong, Yue Ying ^a   Rao, Vempati Srinivasa ^a   Wai, Leong Ching ^a   Lau, John H ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BUMP INTERCONNECTS; CURRENT-STRESSING; ELECTRICAL RESISTANCES; ELECTROLESS; ELECTRON FLOW; ELECTRON WIND; ELECTRONS FLOW; FLIP CHIP JOINTS; FOUR-POINT; HIGH TEMPERATURE INTERMETALLICS; KELVIN STRUCTURES; KIRKENDALL VOID; LOW TEMPERATURE SOLDERS; MICRO-BUMPS; PLATEAU REGION; RESISTANCE INCREASE; SN-AG SOLDER; SN-AG SOLDER BUMP; SOLDER BUMP; SOLDER BUMP INTERCONNECTS; STEADY STATE; TEST TEMPERATURES; UNDER BUMP METALLIZATION;

CRACKS; ELECTROMIGRATION; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; TIN;

SOLDERING;

EID: 70349862075     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074124     Document Type: Conference Paper

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