Electromigration reliability and morphologies of Cu pillar flip-chip solder joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 330-335

  Lai, Yi Shao ^a   Chiu, Ying Ta ^a   Lee, Chiu Wen ^a   Shao, Yu Hsiu ^a   Chen, Jiunn ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COMPUTER NETWORKS; COPPER; ELECTROMIGRATION; FLIP CHIP DEVICES; ORES; RELIABILITY; SILVER; WELDING;

FLIP CHIPPING; SOLDER JOINTS;

TIN;

EID: 51349109370     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4549991     Document Type: Conference Paper

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