Development of 30 micron pitch bump interconnections for COC-FCBGA

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1216-1222

  Iwasaki, Toshihiro ^a   Watanabe, Masaki ^a   Baba, Shinji ^a   Hatanaka, Yasumichi ^b   Idaka, Shiori ^b   Yokoyama, Yoshinori ^b   Kimura, Michitaka ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

^b MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP-CHIP BGA PACKAGE WITH COC STRUCTURE (COC-FCBGA); HIGH-END SYSTEM; MICROBUMP INTERCONNECTION; ULTRA-FINE PITCH BUMP;

ELECTRONICS PACKAGING; METALLOGRAPHY; PLATING; THICKNESS MEASUREMENT;

FLIP CHIP DEVICES;

EID: 33845579337     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645807     Document Type: Conference Paper

References (4)

1. th Electronic Components and Technology Conf, Orlando, FL, May. 2005, pp. 9-13.
2. th VLSI Packaging Workshop of Japan Technical Digest, Kyoto, Nov. 2002, pp. 25-28.
3. E.Hayashi, S.Wakiyama, K.Harada, S.Baba, T.Ozawa, A.Maeda, M.Kimura, "Pb-free Solder Bump Bonding for High Pin Count Flip-chip BGA Using Organic Substrate," Proc 2003 International Conference on Electronics Packaging, Tokyo, April. 2003, pp.465-470
4. Y. Yokoyama, H. Fukumoto, H. Hata, Y. Nakaki, M. Takeda,"Wafer level vacuum packaging technology using molten solder ejection method", Proc. 37th Int. sympo. Microelectronics (IMAPS '04), Long Beach, CA, WA-82, Nov.14-18, 2004.