Electromigration of Cu-Sn-Cu micropads in 3D interconnect

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 12-17

  Huang, Zhihong ^a   Chatterjee, Ritwik ^a   Justison, Patrick ^a   Hernandez, Richard ^a   Pozder, Scott ^a   Jain, Ankur ^a   Acosta, Eddie ^a   Gajewski, Donald A ^a   Mathew, Varughese ^a   Jones, Robert E ^a  

^a FREESCALE SEMICONDUCTOR   (United States)

Author keywords

3D integrated circuit; 3D interconnect; Electromigration; Failure analysis

Indexed keywords

COMPUTER NETWORKS; COPPER; DIES; ELECTROMIGRATION; INTERCONNECTION NETWORKS; MECHANISMS; SAFETY FACTOR; TIN;

3D INTEGRATED CIRCUIT; 3D INTERCONNECT; ELECTRONIC COMPONENTS; FAILURE MECHANISMS; MICROCONNECTS;

FAILURE ANALYSIS;

EID: 51349121679     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4549943     Document Type: Conference Paper

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