A high-precision apparatus for the characterization of thermal interface materials

Review of Scientific Instruments

Volumn 80, Issue 9, 2009, Pages

  Kempers, R ^a,b   Kolodner, P ^b   Lyons, A ^b,c   Robinson, A J ^a  

^a TRINITY COLLEGE DUBLIN   (Ireland)

^b LUCENT TECHNOLOGIES   (United States)

^c CITY UNIVERSITY OF NEW YORK   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EFFECTIVE THERMAL CONDUCTIVITY; ELECTRICAL CONTACT RESISTANCE; ELECTRICAL RESISTANCES; HEAT LEAKAGE; HEAT TRANSFER RATE; HIGH-PRECISION; SAMPLE THICKNESS; SIMULTANEOUS MEASUREMENT; SURFACE TEMPERATURES; TEMPERATURE GRADIENT; THERMAL INTERFACE MATERIALS; THERMAL RESISTANCE;

CONTACT RESISTANCE; ELECTRONIC EQUIPMENT; ERROR ANALYSIS; GRAPHITE; METRIC SYSTEM; TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMOANALYSIS; UNCERTAINTY ANALYSIS;

HEAT RESISTANCE;

EID: 70349687320     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3193715     Document Type: Article

References (38)

1. B. Smith, T. Brunschwiler, and B. Michel, Microelectron. J. 0026-2692 40 (9), 1379-1386 (2008) 10.1016/j.mejo.2008.06.079.
2. R. Linderman, T. Brunschwiler, B. Smith, and B. Michel, Proc. THERMINIC (THERMINIC, Budapest, 2007), pp. 129-134.
3. A. Ziaei and S. Demoustier, Proc. THERMINIC (THERMINIC, Rome, 2008), pp. 153-155.
4. J. Liu, B. Michel, M. Rencz, C. Tantolin, C. Sarno, R. Miessner, K. V. Schuett, X. Tang, S. Demoustier, and A. Ziaei, Proc. THERMINIC (THERMINIC, Rome, 2008), pp. 156-161.
5. J. J. W. Tzeeng, T. W. Weber, and D. W. Krassowski, Proc. 16th IEEE SEMI-THERM Symposium (SEMI-THERM, San Jose, 2000), pp. 174-181.
6. P. Teertstra, Proc. InterPACK 2007 (InterPACK, Vancouver, 2007), pp. 381-388.
7. R. Kempers, R. Frizzell, A. Lyons, and A. J. Robinson, Proc. InterPACK 2009 (InterPACK, San Francisco, 2009), Paper No. IPACK2009-89366.
8. E. G. T. Bosch and C. J. M. Lasance, Proc. 16th IEEE SEMI-THERM Symposium (SEMI-THERM, San Jose, 2000), pp. 167-173.
9. C. J. M. Lasance and C. Lacaze, Proc. 12th IEEE SEMI-THERM Symposium (SEMI-THERM, Phoenix, 1996), pp. 43-45.
10. C. J. M. Lasance, C. T. Murray, D. L. Saums, and M. Rencz, Proc. 22nd IEEE SEMI-THERM Symposium (SEMI-THERM, Dallas, 2006), pp. 42-49.
11. M. R. Rencz and V. Sźkely, IEEE Trans. Compon. Packag. Technol. 1521-3331 25, 547 (2002). 10.1109/TCAPT.2002.808003
12. M. Rencz, V. Sźkely, G. Farkas, and B. Courtois, Proc. IEEE Inter-Society Conference on Thermal Phenomena (ITHERM, San Diego, 2002), pp. 136-141.
13. B. Smith, T. Brunschwiler, and B. Michel, Proc. 13th Workshop on Thermal Issues in ICs and Systems (THERMINIC, Budapest, 2007), pp. 134-139.
14. W. Parker, R. Jenkins, C. Butler, and G. Abbott, J. Appl. Phys. 0021-8979 32, 1679 (1961). 10.1063/1.1728417
15. L. Kehoe, P. V. Kelly, and G. M. Crean, Microsyst. Technol. 0946-7076 5, 18 (1998). 10.1007/s005420050135
16. P. S. Gaal, M. A. Thermitus, and D. E. Stroe, J. Therm. Anal. Calorim. 78, 185 (2004). 10.1023/B:JTAN.0000042166.64587.33 1388-6150
17. V. Khuu, M. Osterman, A. Bar-Cohen, and M. Pecht, Proc. InterPACK, (InterPACK, Vancouver, 2007), pp. 405-414.
18. J. P. Gwinn, M. Saini, and R. L. Webb, Proc. IEEE Inter-Society Conference on Thermal Phenomena (ITHERM, San Diego, 2002), pp. 644-650.
19. " Standard test method for thermal transmission properties of thermally conductive electrical insulation materials.," ASTM Standard D5470-06, Copyright ASTM International, Conshohocken, PA, 2007.
20. D. Kearns, Proc. 19th IEEE Semi-Therm Symposium (SEMI-THERM, San Jose, 2003), pp. 129-133.
21. J. R. Culham, P. Teertstra, I. Savija, and M. M. Yovanovich, Proc. IEEE Inter-Society Conference on Thermal Phenomena (ITHERM, San Diego, 2002), pp. 128-134.
22. I. Savija, J. R. Culham, and M. M. Yovanovich, Proc. InterPACK (InterPACK, Maui, 2003), pp. 567-574.
23. V. V. Rao, K. Bapurao, J. Nagaraju, and M. V. Krishna Murthy, Meas. Sci. Technol. 0957-0233 15, 275 (2004). 10.1088/0957-0233/15/1/040 (Pubitemid 38158246)
24. P. Misra and J. Nagaraju, Rev. Sci. Instrum. 0034-6748 75, 2625 (2004). 10.1063/1.1775316
25. V. Singhal, P. J. Litke, A. F. Black, and S. V. Garimella, Int. J. Heat Mass Transfer 0017-9310 48, 5446 (2005). 10.1016/j.ijheatmasstransfer.2005.06. 028 (Pubitemid 41650258)
26. C. V. Madhusudana, Int. Commun. Heat Mass Transfer 0735-1933 27, 877 (2000). 10.1016/S0735-1933(00)00168-8 (Pubitemid 30817151)
27. R. Kempers, P. Kolodner, A. Lyons, and A. J. Robinson, Proc. IEEE ITherm (ITHERM, Orlando, 2008), pp. 221-226.
28. P. Kolodner, M. Hodes, I. Ewes, and P. Holmes, Proc. InterPACK (InterPACK, San Francisco, 2005), pp. 91-98.
29. M. A. Kedzierski and J. L. Worthington, Exp. Heat Transfer 6, 329 (1993).
30. Keithley, Low Level Measurements Handbook: Precision DC Current, Voltage, and Resistance Measurements, 6th ed. (Keithley Instruments, Cleveland, OH, 2004).
31. A. Wald, Ann. Math. Stat. 0003-4851 11, 284 (1940). 10.1214/aoms/ 1177731868
32. M. S. Bartlett, Biometrics 0006-341X 5, 207 (1949). 10.2307/3001936
33. W. H. Press, S. A. Teukosky, W. T. Vetterling, and B. P. Flannery, Numerical Recipes in FORTRAN-The Art of Scientific Computing, 2nd ed. (Cambridge University Press, Cambridge, 1992), Chap.
34. H. H. Ku, NBS Report No. 8677, 1965.
35. S. J. Kline and F. A. McClintock, Mech. Eng. (Am. Soc. Mech. Eng.) 0025-6501 75, 3 (1953).
36. M. M. Yovanovich, IEEE Trans. Compon. Packag. Technol. 1521-3331 28, 182 (2005). 10.1109/TCAPT.2005.848483 (Pubitemid 40871070)
37. R. Kempers, A. Lyons, and A. J. Robinson, Proc. DSL, Rome, Italy, 24-26 June 2009, article DSL 514 (unpublished).
38. " The International Technology Roadmap for Semiconductors 2007 edition: Assembly and packaging.," International Technology Roadmap for Semiconductors, 2007.