Transient method for the accurate measurement of interface thermal resistances

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1996, Pages 43-50

  Lasance, Clemens J M ^a   Lacaze, Celine ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; HEAT LOSSES; HEAT TRANSFER; MICROELECTRONIC PROCESSING; NUMERICAL ANALYSIS; SURFACE MOUNT TECHNOLOGY; THERMAL VARIABLES MEASUREMENT; THERMODYNAMIC PROPERTIES;

CONTACT RESISTANCE; INTERFACE THERMAL RESISTANCE; TRANSIENT METHOD;

ELECTRONICS PACKAGING;

EID: 0029714057     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (22)