Thermal conductivity and contact resistance measurements for adhesives

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 1, Issue , 2007, Pages 381-388

  Teertstra, Peter ^a,b  

^a UNIVERSITY OF WATERLOO   (Canada)

^b ASME

Author keywords

[No Author keywords available]

Indexed keywords

ASTM TEST STANDARD D-5470; BULK MATERIALS; THERMAL CONTACT RESISTANCE;

CERAMIC MATERIALS; CONTACT RESISTANCE; HEAT FLUX; INSULATING MATERIALS; THERMAL CONDUCTIVITY;

ADHESIVES;

EID: 40449111845     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33026     Document Type: Conference Paper

References (12)