An experimentally validated thermo-mechanical model for the prediction of thermal contact conductance

International Journal of Heat and Mass Transfer

Volumn 48, Issue 25-26, 2005, Pages 5446-5459

  Singhal, Vishal ^a   Litke, Paul J ^a   Black, Anthony F ^a   Garimella, Suresh V ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Constriction resistance; Electronics cooling; Surface characterization; Surface deformation analysis; Thermal contact conductance

Indexed keywords

ELASTOPLASTICITY; MATHEMATICAL MODELS; SURFACE ROUGHNESS; THERMAL EFFECTS; THERMOMECHANICAL TREATMENT;

CONSTRICTION RESISTANCE; ELECTRONICS COILING; SURFACE CHARACTERIZATION; SURFACE DEFORMATION ANALYSIS; THERMAL CONTACT CONDUCTANCE;

THERMAL CONDUCTIVITY OF LIQUIDS;

COOLING; ELECTRONICS INDUSTRY;

EID: 27844581235     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2005.06.028     Document Type: Article

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