Design, assembly and commissioning of a test apparatus for characterizing thermal interface materials

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 128-135

  Culham, J R ^a   Teertstra, P ^a   Savija, I ^a   Yovanovich, M M ^a  

^a UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Assembly; Building materials; Inorganic materials; Materials testing; Phase change materials; Polymers; Rough surfaces; Surface roughness; Thermal expansion; Thermal loading

Indexed keywords

ASSEMBLY; BUILDING MATERIALS; INTERFACES (MATERIALS); MATERIALS TESTING; MICROELECTRONICS; POLYMERS; SURFACE MEASUREMENT; SURFACE ROUGHNESS; SURFACE TESTING; THERMAL EXPANSION; THERMAL INSULATING MATERIALS;

DESIGN AND CONSTRUCTION; INORGANIC MATERIALS; INTERSTITIAL MATERIALS; MICROELECTRONIC APPLICATIONS; ROUGH SURFACES; THERMAL INTERFACE MATERIALS; THERMAL LOADINGS; THERMO-MECHANICAL CHARACTERISTICS;

PHASE CHANGE MATERIALS;

EID: 84950156702     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012448     Document Type: Conference Paper

References (7)

1. Cooper, M., Mikic, B. and Yovanovich, M.M., "Thermal Contact Conductance," Journal of Heat and Mass Transfer, vol. 12, pp. 279-300, 1969.
2. Yovanovich, M.M., DeVaal, J.W. and Hegazy, A.A., "A statistical Model to Predict Thermal Gap Conductance Betweem Conformint Rough Surfaces," AIAA paper no. 82-0888, AIAA/ASME 3rd Joint Thermophysics, Fluids, Plasma and Heat Transfer Conference, St. Louis, Missouri, June 7-11, 1982.
3. Johnson, K.L., Contact Mechanics, Cambridge University Press, 1985.
4. Johnson, K.L., Greenwood, J.A. and Higginson, J.G., "The Contact of Elastic Wavy Surfaces," International Journal of Mechanical Sciences, 27, (401), 1985.
5. Savija, I., Culham, J.R., M.M. Yovanovich and Marotta, E.E., "Review of Thermal Conductance Models for Joints Incorporating Enhancement Materials," AIAA 2002-0494, 49th AIAA Aerospace Sciences Meeting and Exhibit, Reno, Nevada, January 14-17, 2002.
6. "Standard Test Method for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials," ASTM D 5470-95, 1995.
7. Personnal communications with Jon Matheson, Hoskin Scientific Limited, Burlington, ON, Canada.