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Volumn , Issue , 2008, Pages 153-155
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NANOPACK - nano packaging technology for interconnect and heat dissipation
a
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Author keywords
[No Author keywords available]
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Indexed keywords
AUTOMOBILE COOLING SYSTEMS;
AUTOMOBILE ELECTRONIC EQUIPMENT;
CARBON NANOTUBES;
DC GENERATORS;
ELECTRONIC EQUIPMENT;
HEAT RESISTANCE;
POWER ELECTRONICS;
TECHNICAL PRESENTATIONS;
TECHNOLOGY;
CHARACTERISATION;
CONTACT FORMATIONS;
ELECTRICAL INTERCONNECTS;
EUROPEANS;
FREQUENCY SWITCHES;
HEAT DISSIPATIONS;
HIGH POWERS;
IMPROVED PERFORMANCES;
INTERFACE MATERIALS;
MANUFACTURING TECHNOLOGIES;
MICRO-PROCESSORS;
MODELING AND SIMULATIONS;
NEW TECHNOLOGIES;
PACKAGING TECHNOLOGIES;
RESEARCH AREAS;
STRUCTURED SURFACES;
THERMAL MANAGEMENTS;
THERMAL RESISTANCES;
PACKAGING MATERIALS;
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EID: 57649201953
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/THERMINIC.2008.4669899 Document Type: Conference Paper |
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Times cited : (4)
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References (0)
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