Comparison of transient and static test methods for chip-to-sink thermal interface characterization

Microelectronics Journal

Volumn 40, Issue 9, 2009, Pages 1379-1386

  Smith, B ^a   Brunschwiler, T ^a   Michel, B ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

Author keywords

Electronics cooling; Interface characterization; Structure function; Thermal interface material; TIM; Transient thermal test

Indexed keywords

ELECTRONICS COOLING; INTERFACE CHARACTERIZATION; STRUCTURE FUNCTION; THERMAL INTERFACE MATERIAL; TIM;

COOLING; ELECTRONIC EQUIPMENT; FATIGUE OF MATERIALS; MICROELECTRONICS; TECHNOLOGICAL FORECASTING; TESTING; THICKNESS MEASUREMENT; UNCERTAINTY ANALYSIS;

THERMAL INSULATING MATERIALS;

EID: 69249213637     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2008.06.079     Document Type: Article

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