Thermal performance measurements of thermal interface materials using the laser flash method

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 1, Issue , 2007, Pages 405-414

  Khuu, Vinh ^a   Osterman, Michael ^a   Bar Cohen, Avram ^a   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GAP FILLERS; LASER FLASH METHODS; SCANNING ACOUSTIC MICROSCOPES; THERMAL PERFORMANCES; THERMOMECHANICAL STRESSES; THREE-LAYER COMPOSITES;

COMPOSITE STRUCTURES; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); LASER BEAM EFFECTS; TEMPERATURE MEASUREMENT; THERMOMECHANICAL TREATMENT;

THERMAL INSULATING MATERIALS;

EID: 40449130028     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33554     Document Type: Conference Paper

References (27)