High-performance thermal interface technology overview

Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC

Volumn , Issue , 2007, Pages 129-134

  Linderman, R ^a   Brunschwiler, T ^a   Smith, B ^a   Michel, B ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

THERMODYNAMIC PROPERTIES;

FLAT INTERFACES; INTERFACE TECHNOLOGY; PARTICLE STACKING; RELIABILITY TESTING; SURFACE CHANNELS; THERMAL PROPERTIES; THERMAL RESISTANCE;

TECHNOLOGY;

EID: 48049108921     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/THERMINIC.2007.4451762     Document Type: Conference Paper

References (22)

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