Improving accuracy and flexibility of ASTM D 5470 for high performance thermal interface materials

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2003, Pages 129-133

  Kearns, Don ^a  

^a SUN MICROSYSTEMS   (United States)

Author keywords

Interface thermal resistance; RTD; Thermal contact resistance; Thermal interface materials (TIM); TIM test apparatus

Indexed keywords

INTERFACES (MATERIALS); MATERIALS TESTING; PRESSURE MEASUREMENT; ROUGHNESS MEASUREMENT; STANDARDIZATION; TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL INSULATION; ACCEPTANCE TESTS; INSULATION; MANUFACTURE; MICROPROCESSOR CHIPS; SURFACE ROUGHNESS; SURFACE TESTING; THERMAL INSULATING MATERIALS; THERMAL VARIABLES MEASUREMENT;

ELECTRICAL INSULATION MATERIALS; INDUSTRY TEST STANDARD; INTERFACE THERMAL RESISTANCE; THERMAL CONTACT RESISTANCE; THERMAL INTERFACE MATERIALS;

THERMAL INSULATING MATERIALS; THERMAL CONDUCTIVITY;

CONDUCTING MATERIALS; INSULATION TESTING; MANUFACTURING INDUSTRIES; MATERIALS RELIABILITIES; ROUGH SURFACES;

EID: 0037272410     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Anter 2022 data sheet, http://www.anter.com/pdf/2022.pdf
2. EDM Labs Ltd. www.edmlabsltd.com.
3. Culham, J.R., Teertstra, P., Savija, I., and Yovanovich, M.M., "Design, Assembly and Comminssioning of a Test Apparatus for Characterizing Thermal Interface Materials", Proc. ITHERM 2002 pp.128-135.
4. 1 of ∼0.3 °C.