Development of a high-accuracy thermal interface material tester

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 221-226

  Kempers, R ^a   Kolodner, P ^b   Lyons, A ^b   Robinson, J ^a  

^a TRINITY COLLEGE DUBLIN   (Ireland)

^b LUCENT TECHNOLOGIES   (United States)

Author keywords

Thermal conductivity measurement; Thermal contact resistance; Thermal impedance; Thermal interface material tester

Indexed keywords

ELECTRONIC EQUIPMENT; ELECTRONICS ENGINEERING; FIGHTER AIRCRAFT; FORMING; METRIC SYSTEM; SENSITIVITY ANALYSIS; THERMOELECTRICITY; THERMOMECHANICAL TREATMENT;

ELECTRONIC SYSTEMS; THERMAL CONDUCTIVITY MEASUREMENT; THERMAL CONTACT RESISTANCE; THERMAL IMPEDANCE; THERMAL INTERFACE MATERIAL TESTER;

UNCERTAINTY ANALYSIS;

EID: 50949118221     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544274     Document Type: Conference Paper

References (8)

1. "Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials," ASTM Standard D-5470-06, Copyright ASTM International, Conshohocken, PA, 2007.
2. Tzeeng, J. J. W., Weber, T. W. and Krassowski, D. W., 2000, "Technical Review on Thermal Conductivity Measurement Techniques for Thin Thermal Interfaces". Sixteenth IEEE Semi-Therm Symposium,.
3. Kearns, D., 2003, "Improving Accuracy and Flexibility of ASTM D5470 for High Performance Thermal Interface Materials" Nineteenth IEEE Sem-Therm Symposium. [4] Gwinn, J. P., Saini, M. & Webb, R. L., 2002, "Apparatus for Accurate Measurement of Interface Resistance of High Performance Thermal Interface Materials", 2002 IEEE Inter-Society Conference on Thermal Phenomena.
4. Culham, J.R., Teerstra, P., Savija, I., & Yovanovich, M.M, 2002, "Design, Assembly and Commissioning of a Test Apparatus for Characterizing Thermal Interface Materials", 2002 IEEE Inter-Society Conference on Thermal Phenomena.
5. Savija, I., Culham, J.R. & Yovanovich, M.M., 2003, "Effective Thermophysical Properties of Thermal Interface Materials: Part 2 Experiments and Data", Proceedings of InterPACK, 2003, Maui, July 6-11.
6. Teerstra et al, 2007, "Thermal Conductivity and Contact Resistance Measurements for Adhesives" Proceedings of InterPACK 2007, Vancouver, July 8-12.
7. Kolodner, P., Hodes, M. Ewes, I and Holmes, P., 2005, "Thermal-Resistance Measurements on Mechanical Gap Fillers", Proceedings of InterPACK 2005, San Francisco, July 17-22.
8. Kline, S.J., and McClintock, F.A., 1953, "Describing uncertainties in single sample experiments", Mech. Eng., 75, pp. 3-8.