Polymer deformation and filling modes during microembossing

Journal of Micromechanics and Microengineering

Volumn 14, Issue 12, 2004, Pages 1625-1632

  Rowland, Harry D ^a   King, William P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; GLASS TRANSITION; PLASTIC FILMS; PLASTIC FLOW; POLYMETHYL METHACRYLATES; SCANNING ELECTRON MICROSCOPY; VISCOSITY;

MICROEMBOSSING; PERIODICITY; PROCESSING TEMPERATURES;

PLASTIC DEFORMATION;

EID: 10844295994     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/14/12/005     Document Type: Article

References (19)

1. Chou S and Krauss P 1997 Imprint lithography with sub-10 nm feature size and high throughput Microelectron. Eng. 35 237-40
2. Khang D and Lee H 1999 Wafer-scale sub-micron lithography Appl. Phys. Lett. 75 2599-601
3. Guo L, Krauss P and Chou S 1997 Nanoscale silicon field effect transistors fabricated using imprint lithography Appl. Phys. Lett. 71 1881-3
4. Guo L and Chao C 2002 Polymer microring resonators fabricated by nanoimprint technique J. Vac. Sci. Technol. B 20 2862-6
5. Lee G et al 2001 Microfabricated plastic chips by hot embossing methods and their applications for DNA separation and detection Sensors Actuators B 75 142-8
6. Charest J et al 2004 Hot embossing for micro patterned cell substrates Biomaterials 25 4767-75
7. Henderson C et al 2004 Microsystems manufacturing via embossing of thermally sacrificial materials Materials Research Society Symposium
8. Heyderman L J et al 2000 Flow behaviour of thin polymer films used for hot embossing lithography Microelectron. Eng. 54 229-45
9. Scheer H C and Schulz H 2001 A contribution to the flow behaviour of thin polymer films during hot embossing lithography Microelectron. Eng. 56 311-32
10. Juang Y-J, Lee L J and Koelling K W 2002 Hot embossing in microfabrication: Part I. Experimental Polym. Eng. Sci. 42 539-50
11. Juang Y-J, Lee L J and Koelling K W 2002 Hot embossing in microfabrication: Part II. Rheological characterization and process analysis Polym. Eng. Sci. 42 551-66
12. Shen X J, Pan L-W and Lin L 2002 Microplastic embossing process: experimental and theoretical characterizations Sensors Actuators A 97-98 428-33
13. Jeong J-H et al 2002 Flow behavior at the embossing stage of nanoimprint lithography Fibers Polym. 3 113-9
14. Cross G L W, O'Connell B and Pethica J B 2003 Mechanical aspects of nanoimprint patterning Nanoimprint and Nanoprint Technology (Boston, MA, December 2003)
15. Clariant Corp. 2000 AZ(R) P4620 Photoresist Material Safety Data Sheet no 7057
16. Williams M L, Landel R F and Ferry J D 1955 Temperature dependence of relaxation mechanisms J. Am. Chem. Soc. 77 3701-7
17. Gere J M 2001 Mechanics of Materials 5th edn pp 139-43
18. Yao D and Kim B 2002 Simulation of the filling process in micro channels for polymeric materials J. Micromech. Microeng. 12 604-10
19. van Krevelen D W 1990 Properties of Polymers (Amsterdam: Elsevier)