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Volumn 43, Issue 10, 2004, Pages 7000-7001

Effect of additives on hole filling characteristics of electroless copper plating

Author keywords

Additives; Bottom up filling; Damascene process; Electroless cu plating

Indexed keywords

ADDITION REACTIONS; ADDITIVES; CHLORINE; DIFFUSION; ELECTROLESS PLATING; SCANNING ELECTRON MICROSCOPY; SILICA; UREA;

BOTTOM-UP FILLING; DAMASCENE PROCESS; ELECTROLESS CU PLATING; THIOUREA;

COPPER PLATING;

EID: 10844222905 PISSN: 00214922 EISSN: None Source Type: Journal
DOI: 10.1143/JJAP.43.7000 Document Type: Article

Times cited : (15)

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