Low-k compatible all-copper flip-chip connections

Microelectronic Engineering

Volumn 86, Issue 3, 2009, Pages 379-386

  Osborn, Tyler ^a   Hunter Lightsey, C ^a   Kohl, Paul A ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Electroless copper; Flip chip; Interconnects; Stress modeling; Thermo mechanical reliability

Indexed keywords

BRAZING; DIELECTRIC MATERIALS; ELASTIC MODULI; FLIP CHIP DEVICES; LEAD; MECHANICAL PROPERTIES; OPTICAL INTERCONNECTS; PLANTS (BOTANY); PROBABILITY DENSITY FUNCTION; RELIABILITY; SOLDERING ALLOYS; STRESSES; THERMOMECHANICAL TREATMENT; WELDING;

ELECTROLESS COPPER; FLIP-CHIP; INTERCONNECTS; STRESS MODELING; THERMO-MECHANICAL RELIABILITY;

COPPER;

EID: 59049088974     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.11.080     Document Type: Article

References (23)

1. International Technology Roadmap for Semiconductors, Assembly and Packaging, 2007.
2. Fan A., Rahman A., and Reif R. Electrochemical and Solid-State Letters 2 10 (1999) 534-536
3. Chen K.N., Fan A., and Reif R. Journal of Electronic Materials 30 4 (2001) 331-335
4. Chen K.N., Fan A., Tan C.S., and Reif R. Journal of Electronic Materials 32 12 (2003) 1371-1374
5. Chen K.N., Tan C.S., Fan A., and Reif R. Electrochemical and Solid-State Letters 7 1 (2004) G14-G16
6. Kim T.H., Howlander M.M., Itoh T., and Suga T. Journal of Vacuum Science and Technology A 21 2 (2003) 449-453
7. Shigetou A., Itoh T., Matsuo M., Hayasaka N., Okumura K., and Suga T. IEEE Transactions on Advanced Packaging 29 2 (2006) 218-226
8. He A., Osborn T., Bidstrup A., Sue A., and Kohl P.A. Electrochemical and Solid-State Letters 9 12 (2006) 192-195
9. Osborn T., He A., Galiba N., and Kohl P.A. Journal of the Electrochemical Society 155 4 (2008) D308-D313
10. He A., Osborn T., Bidstrup A., Sue A., and Kohl P.A. Journal of the Electrochemical Society 155 4 (2008) D314-D322
11. Zhu Q., Ma L., and Sitaraman S.K. IEEE Transactions on Advanced Packaging 26 2 (2003) 106-112
12. Zhu Q., Ma L., and Sitaraman S.K. IEEE Transactions on Components and Packaging Technologies 26 3 (2003) 582-590
13. Zhu Q., Ma L., and Sitaraman S.K. Journal of Electronic Packaging, Transactions of the ASME 126 2 (2004) 237-246
14. Kacker K., Sokol T., Yun W., Swaminathan M., and Sitaraman S.K. Journal of Electronic Packaging Transactions of the ASME 129 4 (2007) 460-468
15. Kacker K., Lo G.C., and Sitaraman S.K. IEEE Transactions on Advanced Packaging 31 1 (2008) 22-32
16. Yoon S.W., Thew S.M.L., Lim S.Y.L., Hnin W.Y., Chai T.C., Viswanath A.G.K., and Kripesh V. IEEE Transactions on Advanced Packaging 31 1 (2008) 58-65
17. Kim K.S., Huh S.H., and Suganuma K. Materials Science and Engineering A 333 (2002) 106-114
18. J.H.L. Pang, B.S. Xiong, C.C. Neo, X.R. Bang, T.H. Low, in: Proceedings - 53rd Electronic Components and Technology Conference, 2003, pp. 673-79.
19. K. Seelig, D. Suraski, in: Proceedings - 50th Electronic Components and Technology Conference, 2000, pp. 1405-1409.
20. T.H. Low, J.H.L. Pang, in: Proceedings of the Electronic Packaging Technology Conference, 2003, p. 791.
21. Kranenburg J.M., Tweedie C.A., Hoogenboom R., Wiesbrock F., Thijs H.M.L., Hendriks C.E., Vlietb K.J.V., and Schubert U.S. Journal of Materials Chemistry 17 (2007) 2713-2721
22. Oliver W.C., and Pharr G.M. Journal of Materials Research 7 6 (1992) 1564-1583
23. Feng R., and Farris R.J. Journal of Micromechanics and Microengineering 13 (2003) 80-88