Evidence for "superfilling" of submicrometer trenches with electroless copper deposit

Applied Physics Letters

Volumn 90, Issue 10, 2007, Pages

  Hasegawa, Madoka ^a   Yamachika, Noriyuki ^a   Shacham Diamand, Yosi ^b   Okinaka, Yutaka ^a   Osaka, Tetsuya ^a  

^a WASEDA UNIVERSITY   (Japan)

^b TEL AVIV UNIVERSITY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROLESS PLATING; FILLERS; POLYETHYLENE GLYCOLS;

ELECTROLESS COPPER DEPOSITION; SUBMICROMETER TRENCHES; SUPERFILLING; TRENCH OPENING;

COPPER DEPOSITS;

EID: 33947100130     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2712505     Document Type: Article

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