Through-hole filling by copper electroplating

Journal of the Electrochemical Society

Volumn 155, Issue 12, 2008, Pages

  Dow, Wei Ping ^a   Chen, Hsiang Hao ^b   Yen, Ming Yao ^a   Chen, Wei Hsiang ^a   Hsu, Kao Hsuang ^c   Chuang, Po Yao ^c   Ishizuka, Hiroshi ^d   Sakagawa, Nobuo ^d   Kimizuka, Ryoichi ^d  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^c Research and Development Department   (Taiwan)

^d Research and Development Center   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; BOOLEAN FUNCTIONS; COPPER; COPPER PLATING; CYCLIC VOLTAMMETRY; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTROPLATING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE;

COPPER ELECTROPLATING; ELECTROCHEMICAL CHARACTERISTICS; HOLE-FILLING; LASER DRILLINGS; MICROVIAS; ORGANIC ADDITIVES; PLATING BATHS; THROUGH HOLES;

PLATING;

EID: 54949135453     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2988134     Document Type: Article

References (25)

1. K. Takagi, H. Honma, and T. Sasabe, IEEE Electr. Insul. Mag. (USA), 19, 27 (2003).
2. V. Sundaram, R. R. Tummala, F. Liu, P. A. Kohl, J. Li, S. A. Bidstrup-Allen, and Y. Fukuoka, IEEE Trans. Adv. Packag., 27, 315 (2004).
3. S. Miura and H. Honma, Surf. Coat. Technol., 169-170, 91 (2003).
4. M. J. Lefebvre, G. Allardyce, M. Seita, H. Tsuchida, M. Kusaka, and S. Hayashi, Circuit World, 29, 9 (2003).
5. W.-P. Dow, H.-S. Huang, and Z. Lin, Electrochem. Solid-State Lett., 6, C134 (2003).
6. W.-P. Dow and H.-H. Chen, Circuit World, 30, 33 (2004).
7. W.-P. Dow and H.-S. Huang, J. Electrochem. Soc., 152, C67 (2005).
8. W.-P. Dow, H.-S. Huang, M.-Y. Yen, and H.-C. Huang, J. Electrochem. Soc., 152, C425 (2005).
9. H. Hagiwara, R. Kimizuka, and H. Honma, in Transactions of the Institute of Metal Finishing, Vol. 84, p. 260 (2006).
10. A. Pohjoranta and R. Tenno, J. Electrochem. Soc., 154, D502 (2007).
11. W.-P. Dow, H.-H. Chen, M.-Y. Yen, and C.-W. Liu, ECS Trans. 10.1149/1.2408880, 2 (6), 259 (2007).
12. W.-P. Dow, M.-Y. Yen, C.-W. Liu, and C.-C. Huang, Electrochim. Acta, 53, 3610 (2008).
13. E. K. Yung, L. T. Romankiw, and R. C. Alkire, J. Electrochem. Soc., 136, 206 (1989).
14. E. K. Yung and L. T. Romankiw, J. Electrochem. Soc., 136, 756 (1989).
15. D. A. Hazlebeck and J. B. Talbot, J. Electrochem. Soc., 138, 1985 (1991).
16. D. A. Hazlebeck and J. B. Talbot, J. Electrochem. Soc., 138, 1998 (1991).
17. J.-W. E. Chern and H. Y. Cheh, J. Electrochem. Soc., 143, 3139 (1996).
18. J.-W. E. Chern and H. Y. Cheh, J. Electrochem. Soc., 143, 3144 (1996).
19. M. Suppa, Circuit World, 34, 25 (2008).
20. H. Ishizuka, N. Sakagawa, R. Kimizuka, and W.-P. Dow, The World Intellectual Property Organization, http://www.wipo.int/pctdb/enia.jsp?ia= JP2004/011846, WO 2006/018872 (2006).
21. P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans, and H. Deligianni, IBM J. Res. Dev., 42, 567 (1998).
22. A. C. West, J. Electrochem. Soc., 147, 227 (2000).
23. P. Dixit and J. Miao, J. Electrochem. Soc., 153, G552 (2006).
24. W.-P. Dow, M.-Y. Yen, S.-Z. Liao, Y.-D. Chiu, and H.-C. Huang, Electrochim. Acta, 53, 8228 (2008).
25. W.-P. Dow and C.-W. Liu, J. Electrochem. Soc., 153, C190 (2006).